2025-05114NoticeWallet

US Investigates Foreign Chips Copying Irish Patents

Published Date: 3/26/2025

Notice

Summary

The U.S. International Trade Commission is launching an investigation into certain foreign-made semiconductor devices and related products that may be infringing on U.S. patents held by two Irish companies. This could lead to restrictions on importing and selling these products in the U.S., potentially shaking up the tech market and protecting American innovation. The investigation started in early 2025, and decisions could impact companies and consumers soon.

Analyzed Economic Effects

4 provisions identified: 0 benefits, 4 costs, 0 mixed.

Section 337 investigation may restrict imports

The U.S. International Trade Commission instituted an investigation on March 20, 2025 into alleged infringement of five U.S. patents. The complainants asked the Commission to consider issuing a limited exclusion order and cease and desist orders that could stop the importation or sale of the accused products in the United States.

Named companies must respond within 20 days

The notice names respondents including Taiwan Semiconductor Manufacturing Company (TSMC), Apple Inc., Broadcom Inc., Lenovo Group, Motorola entities, OnePlus (Shenzhen), and Qualcomm Inc. Responses to the complaint must be submitted in accordance with 19 CFR 210.13 and will be considered if received not later than 20 days after the date of service by the Commission; failure to timely respond may be deemed a waiver and can lead to findings and orders without further notice.

Specific products defined as accused

The investigation covers: (a) non-x86 semiconductor devices (i.e., not made by or for Intel or AMD) consisting of wafers or dies made using TSMC's 7 nm and smaller process nodes outside the United States; (b) products containing those devices including standalone integrated circuits, circuit boards, and systems such as smartphones, tablets, personal computers, smartwatches, and network units; and (c) components including partial wafers, integrated circuit packaging, and system subassemblies.

Alleged patent claims targeted

The complaint alleges infringement of specific claims of five U.S. patents: claims 1-5 and 7-11 of U.S. Patent No. 7,745,847; claims 1-10 of U.S. Patent No. 9,093,473; claims 1-3, 6, and 7 of U.S. Patent No. 9,147,747; claims 1, 3-9, 11-15, and 17-20 of U.S. Patent No. 9,184,292; and claims 1-12 of U.S. Patent No. 9,953,880.

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Key Dates

Effective Date
Published Date
3/20/2025
3/26/2025

Department and Agencies

Department
Independent Agency
Agency
International Trade Commission
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