Section 100115

Educ. Code § 100115, under Higher Education Facilities Program.

Educ. Code § 100115

Nine hundred seventy-five million dollars ($975,000,000) of the proceeds of bonds issued and sold pursuant to this chapter shall be deposited in the 1996 Higher Education Capital Outlay Bond Fund, which is hereby created.

(Amended by Stats. 2013, Ch. 28, Sec. 3. (SB 71) Effective June 27, 2013. Note: This section was added by Stats. 1996, Ch. 1, and approved in Prop. 203 on March 26, 1996.)