Section 67346

Educ. Code § 67346, under Higher Education Facilities Bond Act Program.

Educ. Code § 67346

The proceeds of bonds issued and sold pursuant to this chapter shall be deposited in the June 1990 Higher Education Capital Outlay Bond Fund, which is hereby created.

(Added by Stats. 1990, Ch. 6, Sec. 1. Approved in Proposition 121 at the June 5, 1990, election.)