Purpose of bonds

Sec. 1. The board may issue bonds to pay the following: (1) The cost of the works that are provided in the district plan. (2) Necessary engineering, legal, and administrative fees. (3) The repayment or refinancing of a loan. [Pre-1995 Recodification Citation: 13-3-3-81 part.] As added by P.L.1-1995, SEC.26.