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SK Hynix America (Purdue Advanced Packaging Fab)
SK Hynix's US subsidiary and operator of the planned advanced HBM packaging facility at Purdue Research Park, West Lafayette, Indiana — announced in April 2023 as the first major US semiconductor manufacturing investment by SK Hynix. This is not a DRAM fab (wafer production remains in South Korea) but an advanced packaging facility where HBM stacks are assembled: multiple DRAM dies bonded together with Through-Silicon Vias (TSVs) and mounted on a logic base die. The Purdue facility targets HBM packaging for US-based AI customers and data centers. CHIPS Act grant: $450M. Timeline: construction 2025-2026, production start targeted 2028. This is strategically significant as the only US-soil HBM assembly facility, reducing one step of AI accelerator supply chain dependence on South Korea.
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