Facility

DVSI AMBE Chip Contract Foundry (Taiwan)

DVSI's AMBE-3000 and AMBE+2 codec ICs are believed to be fabricated at contract semiconductor foundries in Taiwan, consistent with the industry-standard fabless design model for low-volume specialty DSP chips. DVSI, as a small private company, does not operate its own semiconductor fabs. The AMBE-3000 is a DSP-based codec IC available in quantities per radio manufacturer order; the most likely foundry partner is in the Hsinchu Science Park ecosystem (TSMC or similar foundries serving specialty DSP chip makers). The exact foundry arrangement is not publicly disclosed by DVSI. This facility entry represents the contract manufacturing dependency rather than a confirmed specific foundry. Source: industry supply chain analysis; DVSI product datasheets at https://www.dvsinc.com/products.html