Facility

SK Hynix Indiana Advanced Packaging Facility (West Lafayette)

SK Hynix $3.87B advanced HBM packaging facility at Purdue Research Park, West Lafayette, Indiana. 430,000 sq ft; ~1,000 jobs. $458M CHIPS Act grant + proposed $500M federal loan. Mass production target: H2 2028. Will perform HBM stack assembly and testing on U.S. soil — critical for U.S. DoD supply chain independence. Source: https://news.skhynix.com/sk-hynix-signs-investment-agreement-of-advanced-chip-packaging-with-indiana/