Producer
SK Hynix
SK Hynix Inc. (KRX: 000660; ~₩66T revenue) is the world's #3 NAND flash manufacturer with ~18% global market share — a position significantly strengthened by its $9B acquisition of Intel's NAND business (completed December 2021), which created the Solidigm subsidiary (formerly Intel NAND) and added the Dalian, China fab. SK Hynix's primary domestic NAND production is at the Cheongju M15X fab (North Chungcheong Province, Korea). SK Hynix is also the world's dominant HBM (High Bandwidth Memory) manufacturer, supplying all of NVIDIA's H100/H200/B200 memory.
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Inputs supplied
3
Goods downstream
7
Facilities
0
Stories
What they make
8 inputs SK Hynix supplies
Click an input to see every good that depends on it, every country that produces it, and every other company in the supply chain.
manufactured
High-Bandwidth Memory (HBM3/HBM3E) →
manufactured
AI Training GPU (H100/H200/B200 class) →
manufactured
HBM (High Bandwidth Memory) Stack →
manufactured
DRAM Memory Modules (LPDDR5/DDR5) →
manufactured
DRAM Memory Modules (LPDDR5/DDR5) →
manufactured
DDR5 DRAM Server Memory →
manufactured
NAND Flash Storage (SSD) →
manufactured
NAND Flash Storage (SSD) →
Where it shows up
Goods downstream
Essential goods that depend on something SK Hynix makes, pick one to see the full supply chain.
Where they make it
7 facilities
SK Hynix Cheongju M15X →
KRCheongju, North Chungcheong · fab
SK Hynix M15X fab (Cheongju, North Chungcheong Province, Korea) is SK Hynix's primary domestic NAND flash manufacturing facility. M15X produces 128-238 layer NAND and is the production home for SK Hynix's enterprise NAND chips. Cheongju is a 300mm fab with capacity approximately 100,000-120,000 NAND wspm. SK Hynix is expanding Cheongju for NAND as DRAM production shifts to Icheon (for HBM). Source: https://www.skhynix.com/eng/about/offices.do
SK Hynix Icheon Campus (M14/M16) →
KRIcheon, Gyeonggi · semiconductor_fab
Primary DRAM manufacturing site; M16 produces LPDDR5 and HBM3. Icheon campus is the global center for SK Hynix memory R&D and advanced production.
SK Hynix Icheon M16 Fab — HBM and Advanced DRAM →
KRIcheon, Gyeonggi-do · fab
SK Hynix's Icheon M16 fab — the world's primary HBM3e production facility and the most consequential DRAM fab for global AI infrastructure. M16 is SK Hynix's most advanced DRAM production line (1a/1b-nm class) and the site where HBM3e — the memory variant required by NVIDIA H100 and H200 AI accelerators — was first produced at volume. In 2023, all HBM3e chips in the world came from this facility; NVIDIA was on a multi-year waitlist. M16 also produces leading-edge DDR5 and LPDDR5X. Icheon campus capacity: M14 + M16 together represent approximately 280,000 wafer starts per month. SK Hynix is building M15X expansion and a new fab at Cheongju (NAND). Source: https://news.skhynix.com/sk-hynix-completes-the-construction-of-m16-fab-the-worlds-most-advanced-dram-production-facility/
SK Hynix Indiana Advanced Packaging Facility (West Lafayette) →
USIndiana · packaging
SK Hynix $3.87B advanced HBM packaging facility at Purdue Research Park, West Lafayette, Indiana. 430,000 sq ft; ~1,000 jobs. $458M CHIPS Act grant + proposed $500M federal loan. Mass production target: H2 2028. Will perform HBM stack assembly and testing on U.S. soil — critical for U.S. DoD supply chain independence. Source: https://news.skhynix.com/sk-hynix-signs-investment-agreement-of-advanced-chip-packaging-with-indiana/
SK Hynix M10F Fab (Icheon) — HBM →
KRGyeonggi Province · fab
SK Hynix M10F fab in Icheon re-purposed for HBM production; targeting ~170,000 HBM units/month in 2025. Part of combined M16+M10 80,000 wafer/month capacity expansion for HBM+DRAM. Operates alongside M16 as the two-fab HBM production base. Source: https://www.tweaktown.com/news/99896/sk-hynix-preparing-to-expand-dram-capacity-hbm-by-80k-wafers-per-month-at-m16-m10-fabs/index.html
SK Hynix M16 HBM Fab Icheon →
KRIcheon, South Korea · semiconductor fab
Primary SK Hynix HBM3/HBM3E production facility; sole-qualified supplier for NVIDIA H100/H200 at product launch; TSV stacking technology; >50% global HBM market share in 2024
SK Hynix Wuxi Fab — DRAM (Export Control Risk) →
CNWuxi, Jiangsu · fab
SK Hynix's Wuxi, China fab — produces approximately 40% of SK Hynix's total DRAM output (primarily older-generation 1y/1z-nm DDR4 and LPDDR4X) and is the company's largest single production site by wafer volume. The Wuxi fab faces significant US export control risk: the US Commerce Department's October 2022 rules (Entity List restrictions) created uncertainty about whether SK Hynix could continue equipment upgrades and expansions at Wuxi. SK Hynix received a temporary waiver for Wuxi in October 2022 (renewable annually) allowing equipment imports to continue, but the waiver creates permanent strategic uncertainty. Any non-renewal of the Wuxi waiver would freeze production at current technology generations, preventing SK Hynix from upgrading Wuxi to advanced nodes — effectively stranding 40% of SK Hynix's production capacity at an aging node. SK Hynix has signaled intent to gradually migrate leading-edge production out of Wuxi to South Korea as wafer equipment lifetimes expire. Source: https://www.reuters.com/technology/south-korean-chipmakers-get-us-waiver-semiconductor-equipment-china-2022-10-09/
What else they do
Business segments
The company's full revenue map, where this supply-chain role fits within their broader business.
DRAM (World #2)
45%High Bandwidth Memory — HBM (Dominant Supplier)
25%NAND Flash (World #3)
20%Advanced Packaging + AI Infrastructure
10%
Intelligence
What's known
Sourced claims about this company's role in supply chains, chokepoints, concentration, incidents, dual-use connections.
Concentration2023
SK Hynix was the sole qualified supplier of HBM3e to NVIDIA at the H100 product launch in March 2023. For approximately 12 months (Q1 2023 through Q1 2024), every HBM3e module installed in every NVIDIA H100 in every data center on Earth was manufactured exclusively at one facility: SK Hynix's M16 fab in Icheon, South Korea. This single-source dependency for the memory subsystem of the world's most in-demand AI accelerator meant that SK Hynix's production yield, capacity decisions, and operational continuity directly gated the global AI infrastructure buildout. NVIDIA's ability to fill H100 orders — with a multi-year customer waitlist at $30,000+ per unit — was physically constrained by how many HBM3e stacks came off SK Hynix's TSV production lines each month. Samsung qualified HBM3e approximately 6 months later; Micron qualified in late 2023. This is the only major semiconductor market in recent memory where a single company at a single facility was the sole global source of a critical product for 12+ months during a demand surge. Source: https://news.skhynix.com/sk-hynix-develops-industry-first-hbm3e/
SK Hynix Newsroom ↗Chokepoint2022
SK Hynix's Wuxi, China fab produces approximately 40% of SK Hynix's total DRAM wafer output — making it SK Hynix's single largest production site — but operates under a US Commerce Department export control waiver that must be periodically renewed. The October 2022 US semiconductor export rules placed South Korean companies' Chinese fabs in legal jeopardy: US-origin equipment (which is the majority of advanced fab tools worldwide) cannot be serviced, upgraded, or replaced at Chinese fabs without a specific license. SK Hynix received a one-year waiver in October 2022 (subsequently extended), but each renewal is subject to US policy decisions. If the Wuxi waiver were terminated, SK Hynix could not upgrade equipment at the fab, effectively freezing it at current technology generations. Over 5-7 years, the Wuxi fab would fall behind the technology frontier and become uncompetitive — representing a ~40% forced reduction in SK Hynix capacity. A sudden Wuxi waiver termination would immediately tighten global DRAM supply, raise DRAM prices, and potentially disrupt the AI server buildout that depends on SK Hynix HBM — a risk SK Hynix is managing by gradually migrating advanced production out of Wuxi. Source: https://www.reuters.com/technology/south-korean-chipmakers-get-us-waiver-semiconductor-equipment-china-2022-10-09/
Reuters ↗Substitution2024
SK Hynix announced a $3.87 billion advanced packaging facility in West Lafayette, Indiana (adjacent to Purdue University) — the first HBM packaging plant in the US. Expected to open 2028, it will perform HBM4 packaging on US soil for the first time, reducing the supply chain's sole concentration in South Korea for US AI hyperscaler customers.
Purdue University Newsroom ↗Capacity2025
For the first time in history, SK Hynix surpassed Samsung to become the world's #1 DRAM manufacturer by revenue in Q1 2025, with a 36% share vs Samsung's 34% — driven by dominance in high-bandwidth memory (HBM3E) for AI accelerators. Samsung's yield struggles on 3nm and HBM3E gave SK Hynix the opening.
KED Global ↗