Facility
SMIC Beijing Fab (N+2 / 7nm-equivalent)
SMIC's Beijing fab (SMIC SZ/SN joint venture with Beijing government) — produced the Kirin 9000s chip for Huawei Mate 60 Pro using a '7nm-equivalent' N+2 DUV multi-patterning process (revealed September 2023). This was a strategic shock to Western intelligence: SMIC achieved ~7nm-class performance without EUV, which US/Dutch export controls were designed to prevent. However, SMIC's DUV-based 7nm has significantly lower yields (~40-50% vs TSMC ~80%+) and higher wafer cost, limiting competitiveness and volume. SMIC cannot progress to 5nm or below without EUV equipment it cannot legally obtain. Source: https://semianalysis.com/2023/09/08/smic-is-shipping-7nm-huawei-chips/
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