Digital
Personal computing devices tied to chips, batteries, displays, and global assembly.
Why it matters · Price pressure, longer lead times, and configuration shortages across consumer and business markets.
12
Inputs
45
Companies
47
Facilities
10
Source countries
How it's made
Silicon Wafer Production
Polysilicon is purified from quartz sand via the Siemens process, then grown into monocrystalline ingots using Czochralski pulling. Ingots are sliced into 300mm wafers, polished to atomic smoothness, and inspected. Shin-Etsu Chemical and SUMCO supply over 50% of global 300mm wafer volume.
Advanced Logic Chip Fabrication (Wafer Fab)
Wafers undergo hundreds of photolithography cycles using ASML EUV (extreme ultraviolet) machines at 13.5nm wavelength to print transistor patterns at 3nm–5nm nodes. TSMC fabs in Hsinchu and Tainan perform this step for virtually all Apple, AMD, Nvidia, and Qualcomm PC chips.
Memory Chip Fabrication (DRAM & NAND)
DRAM is fabricated at Samsung (Hwaseong/Pyeongtaek), SK Hynix (Icheon/Wuxi), and Micron (Boise/Hiroshima). NAND flash for laptop SSDs is produced by the same trio plus Kioxia (Japan). These three plants supply all laptop memory.
Chip Packaging & Substrate Bonding
Bare dies are mounted onto ABF (Ajinomoto Build-up Film) substrates—a flip-chip BGA package. Substrates are manufactured by Ibiden and Shinko Electric in Japan. Advanced packaging (CoWoS, TSMC) and OSAT houses (ASE, Amkor) bond dies, attach heat spreaders, and test.
Display Panel Manufacturing
LCD or OLED panels are fabricated in large-scale fabs (Gen 8.5–Gen 10.5). China now controls 72% of global LCD capacity (BOE, CSOT) and >50% of OLED capacity. Panels are cut to laptop sizes (13"–17"), backlit, and assembled with touch/polarizer layers.
PCB Fabrication & SMT Assembly
Motherboards, power boards, and daughter cards are fabricated from FR-4/ABF laminates, then populated via surface-mount technology (SMT). ODMs (Quanta, Compal, Wistron, Foxconn) in Taiwan and China run high-volume SMT lines mounting SoCs, DRAM, SSDs, Wi-Fi chips, and power ICs.
Final Assembly & Testing
Chassis parts (aluminum extrusions, plastic injection moldings) are assembled with keyboard, trackpad, battery, display hinge, and ports. Functional testing, BIOS flashing, OS installation, and cosmetic inspection occur before boxing. Quanta and Compal each assemble ~30% of global laptops.
Logistics & Customs Clearance
Finished units ship ocean freight (40-day transit) or air freight from Chongqing, Kunshan, or Taipei to regional distribution centers. U.S. Section 301 tariffs, CHIPS Act incentives, and India PLI schemes are reshaping where final assembly occurs.
What it's made of
12 raw inputs feed computers and laptops. Inputs flagged with ● are critical, without them, production halts.
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Where it comes from
Weighted share of upstream inputs sourced from each country.
| Country | Weighted share | Inputs supplied to computers and laptops |
|---|---|---|
| CDDemocratic Republic of Congono map | 74% | Refined Cobalt Metal |
| TWTaiwan | 38% | ABF Substrate Film (Ajinomoto Build-up Film) · Advanced Logic Chips (CPU/SoC ≤5nm) · Laptop Display Panels (LCD/OLED) +2 |
| JPJapan | 32% | ABF Substrate Film (Ajinomoto Build-up Film) · Laptop Display Panels (LCD/OLED) · DRAM Memory Modules (LPDDR5/DDR5) +5 |
| CNChina | 32% | Advanced Logic Chips (CPU/SoC ≤5nm) · Laptop Display Panels (LCD/OLED) · DRAM Memory Modules (LPDDR5/DDR5) +3 |
| KRSouth Korea | 26% | Advanced Logic Chips (CPU/SoC ≤5nm) · Laptop Display Panels (LCD/OLED) · DRAM Memory Modules (LPDDR5/DDR5) +4 |
| SGSingapore | 11% | DRAM Memory Modules (LPDDR5/DDR5) · 300mm Silicon Wafers |
| DEGermany | 5% | EUV Photoresist · NdFeB Rare Earth Magnets · 300mm Silicon Wafers |
| ATAustria | 5% | ABF Substrate Film (Ajinomoto Build-up Film) |
| USUnited States | 5% | Advanced Logic Chips (CPU/SoC ≤5nm) · Laptop Display Panels (LCD/OLED) · DRAM Memory Modules (LPDDR5/DDR5) +4 |
| PHPhilippines | 4% | Refined Cobalt Metal |
Who makes it
45 companies in this supply chain, sorted by market share.
Subsidiary of Ajinomoto Group; sole commercial producer of ABF (Ajinomoto Build-up Film) used in ~95% of CPU and GPU substrates worldwide. ABF was invented from waste byproducts of MSG manufacturing.
Supplies these inputs
ABF Substrate Film (Ajinomoto Build-up Film)
Replaceability
Substitutability 5% · 36 mo to replace
Business segments
Taiwan Semiconductor Manufacturing Company (TWSE: 2330; founded 1987 by Morris Chang); the world's dominant pure-play foundry and the most critical single company in the global technology supply chain. TSMC manufactures approximately 90% of all sub-5nm logic chips globally, including every NVIDIA AI GPU (H100 on N4, H200 on N4X, B200 on N3E), every Apple processor (A18 on N3E, M4 on N3E), and every AMD data center chip. TSMC's N3 and N5 fabs are located in Taiwan — 100 miles from mainland China. Revenue: $93.7B (2024, +34% YoY). AI/HPC share of revenue: 57% (Q3 2025), up from 18% in 2019. N2 volume production began Q4 2025 at Fab 22 Kaohsiung — world's first 2nm logic node in production. TSMC Arizona Fab 21 Phase 1 (N4P) reached 92% yield and profitability in 2025. CHIPS Act recipient: $6.6B grant + $5B loan.
Supplies these inputs
Advanced Logic Chips (CPU/SoC ≤5nm) · 300mm Silicon Wafers
Replaceability
Substitutability 3% · 36 mo to replace
Business segments
Samsung Electronics Co., Ltd. (KRX: 005930; ~$200B revenue) is the world's largest NAND flash memory manufacturer with ~33% global market share. Samsung's NAND operations span the Pyeongtaek P3 complex (South Korea) and — critically — the Xi'an, Shaanxi, China facility, which is Samsung's largest single NAND fab by capacity. Samsung received a one-year BIS export control exemption (later extended) to continue upgrading Xi'an equipment under US restrictions. Samsung pioneered 3D NAND V-NAND technology in 2013 (first commercial 3D NAND) and now produces 200+ layer V-NAND. Also produces DRAM (world's largest) and logic chips (Exynos, foundry).
Supplies these inputs
DRAM Memory Modules (LPDDR5/DDR5) · NAND Flash Storage (SSD)
Replaceability
Substitutability 20% · 18 mo to replace
Business segments
Japan's leading manufacturer of high-end ABF flip-chip BGA substrates for Intel, AMD, and Nvidia CPUs and GPUs. Dominant player alongside Shinko Electric; both received Japanese government subsidies to expand capacity.
Supplies these inputs
ABF Substrate Film (Ajinomoto Build-up Film)
Replaceability
Substitutability 10% · 18 mo to replace
Business segments
Amperex Technology Limited (ATL; headquartered Dongguan, Guangdong, China) is the world's largest manufacturer of LCO (lithium cobalt oxide) battery cells for consumer electronics, holding approximately 35-40% of the global smartphone and tablet cell market. ATL was founded in 1999 in Hong Kong and relocated primary operations to Dongguan. The company was acquired by TDK Corporation (Japan; TYO: 6762) in 2005 for approximately ¥10.5B — making a Chinese battery maker a wholly-owned subsidiary of a Japanese electronics conglomerate. ATL is the primary cell supplier for Apple iPhone (jointly with Samsung SDI), Google Pixel, Huawei smartphones, and virtually all major Android OEM devices. ATL's primary LCO cell manufacturing campus is in Dongguan, Guangdong; it also operates a major facility in Ningde, Fujian (the same city whose name gives CATL — Contemporary Amperex Technology Limited — its identity, though ATL and CATL are entirely separate companies). ATL is privately held within TDK and does not publish standalone financials; revenue is estimated at $5-7B+ annually.
Supplies these inputs
Lithium-Ion Battery Cells (Li-Co/NMC)
Replaceability
Substitutability 10% · 24 mo to replace
Business segments
SK Hynix Inc. (KRX: 000660; ~₩66T revenue) is the world's #3 NAND flash manufacturer with ~18% global market share — a position significantly strengthened by its $9B acquisition of Intel's NAND business (completed December 2021), which created the Solidigm subsidiary (formerly Intel NAND) and added the Dalian, China fab. SK Hynix's primary domestic NAND production is at the Cheongju M15X fab (North Chungcheong Province, Korea). SK Hynix is also the world's dominant HBM (High Bandwidth Memory) manufacturer, supplying all of NVIDIA's H100/H200/B200 memory.
Supplies these inputs
DRAM Memory Modules (LPDDR5/DDR5) · NAND Flash Storage (SSD)
Replaceability
Substitutability 15% · 18 mo to replace
Business segments
Integrated device manufacturer producing DRAM, NAND flash, and OLED panels. Second-largest foundry. Led global DRAM market until Q1 2025 when SK Hynix surpassed it.
Supplies these inputs
DRAM Memory Modules (LPDDR5/DDR5) · NAND Flash Storage (SSD)
Replaceability
Substitutability 15% · 18 mo to replace
Business segments
JSR Corporation (Tokyo; formerly JASDAQ/TSE: 4185; now private after delisting following Japan Investment Corporation nationalization in 2023) is Japan's leading life science materials company and manufacturer of Amsphere A3 Protein A affinity resin — one of the fastest-growing Protein A resin brands. JSR's Amsphere A3 uses a novel polymer bead architecture (highly cross-linked polymethacrylate) with proprietary recombinant Protein A ligand — designed for high dynamic binding capacity and long resin lifetime. In April 2023, the Japanese government's sovereign industrial fund INCJ (Innovation Network Corporation of Japan, now JIC) acquired a majority stake in JSR Corporation and took it private — an extraordinary step justified by JSR's dual strategic importance in semiconductor photoresists (JSR is the world's #2 photoresist producer, supplying TSMC and Samsung) and bioprocess materials (Amsphere A3). Japan explicitly nationalized JSR to prevent acquisition by non-Japanese parties and to secure domestic control of critical semiconductor and bioprocess supply chains — a template for strategic industry policy that no other major economy had applied to a life science materials company.
Supplies these inputs
EUV Photoresist
Replaceability
Substitutability 8% · 24 mo to replace
Business segments
Shin-Etsu Chemical Co., Ltd. (Tokyo; TSE: 4063; ~¥2.3 trillion revenue) is Japan's second-largest EUV photoresist supplier, holding approximately 20-25% of the EUV photoresist market through its SEPR (Shin-Etsu Polymer Resist) product line. Primary EUV resist production at Niigata and Gunma facilities in Japan. The same parent company is the world's largest polyvinyl chloride (PVC) producer, the world's largest silicon wafer producer (through Shin-Etsu Silicones/SEH), and a major hydroxypropyl methylcellulose (HPMC) pharmaceutical excipient manufacturer. Shin-Etsu's photoresist was among the materials covered by Japan's July 2019 export controls targeting South Korea, as fluorinated polyimide — a resist ancillary material — was one of the three restricted chemicals.
Supplies these inputs
EUV Photoresist · NdFeB Rare Earth Magnets · 300mm Silicon Wafers
Replaceability
Substitutability 10% · 24 mo to replace
Business segments
World's second-largest silicon wafer manufacturer (~25–30% global share). Pure-play wafer company (unlike Shin-Etsu which is diversified). Sumco + Shin-Etsu together supply 60–70% of global 300mm semiconductor wafers. Samsung is a major investor (via SK Siltron subsidiary).
Supplies these inputs
300mm Silicon Wafers
Replaceability
Substitutability 30% · 24 mo to replace
Business segments
BOE Technology Group Co. (SZSE: 000725; ~¥200B revenue; state-owned enterprise ultimately controlled by Beijing municipal government through BOEAG) is China's national champion display maker and world's largest laptop LCD panel supplier; ~20%+ and growing share of global laptop panels. BOE received an estimated $60B+ in cumulative state subsidies (grants, subsidized land, below-market loans from policy banks) from 2003-2024 — by far the largest state-sponsored industrial buildout in display manufacturing history. Key fabs: Beijing B7 (Gen 8.5), Chengdu B7+ (Gen 8.6+), Wuhan B10 (Gen 10.5), Chongqing B10+ (Gen 10.5+), Fuzhou B18 (Gen 8.6 OLED). BOE is the first Chinese company to qualify as a supplier for Apple MacBook Pro OLED panels (starting 2024 qualification; production ramp 2025-2026 — though Samsung Display and LG Display remain Apple's primary OLED sources). BOE's aggressive expansion drove LG Display and AUO out of mainstream LCD into OLED/specialty.
Supplies these inputs
Laptop Display Panels (LCD/OLED)
Replaceability
Substitutability 30% · 18 mo to replace
Business segments
Micron Technology, Inc. (Nasdaq: MU; ~$25B revenue) is the world's #5 NAND flash manufacturer with ~11% global market share. Micron's NAND operations span Boise ID (R&D and manufacturing), Hiroshima Japan (inherited from Elpida Memory acquisition 2013, produces NAND and DRAM), and Singapore (300mm NAND wafers). Micron is the only US-headquartered company with significant NAND manufacturing scale. Micron has been aggressive on 3D NAND layer count — reaching 232-layer QLC in 2022 — and also leads in 3D NAND cost efficiency per bit through innovative array architecture.
Supplies these inputs
DRAM Memory Modules (LPDDR5/DDR5) · NAND Flash Storage (SSD)
Replaceability
Substitutability 15% · 18 mo to replace
Business segments
AU Optronics Corporation (TWSE: 2409; ~NT$200B revenue; formed 2001 from merger of Acer Display Technology and Unipac Optoelectronics) is Taiwan's largest display panel maker and world's second-largest laptop LCD panel supplier; ~25% laptop panel market share. AUO's key fabs: Longtan (L8G fab, Gen 8.5 glass, Taoyuan — premium gaming and high-refresh-rate panels) and Houli (L6G fab, Gen 6, Taichung). AUO Crystal (Kunshan, China) joint venture for mid-range panels. AUO specializes in premium gaming panels (144Hz+ refresh, 2K/4K resolution) and professional display segments where BOE's commodity pricing advantage is weaker. AUO's OLED development: small-panel AUM OLED joint venture (with AUO Crystal); limited laptop OLED volume.
Supplies these inputs
Laptop Display Panels (LCD/OLED)
Replaceability
Substitutability 50% · 12 mo to replace
Business segments
Second-largest silicon wafer manufacturer globally with ~23% share of 300mm market. Joint venture heritage from Mitsubishi Materials and Sumitomo Metal Industries. Critical supplier to TSMC and Samsung.
Supplies these inputs
300mm Silicon Wafers
Replaceability
Substitutability 25% · 36 mo to replace
Business segments
Innolux Corporation (TWSE: 3481; ~NT$350B revenue; formed 2010 from merger of Chi Mei Optoelectronics and Innolux Display; subsidiary of Foxconn/Hon Hai Precision) is Taiwan's second-largest display maker and world's third-largest laptop LCD supplier; ~22% laptop panel market share. Innolux's primary manufacturing complex spans Tainan Science Park (Gen 8.5 and Gen 6 fabs). As a Foxconn subsidiary, Innolux is deeply integrated into the Apple supply chain — Innolux panels are used in MacBook Air models. Innolux is also transitioning toward OLED but remains primarily an LCD maker. The Foxconn parentage gives Innolux manufacturing scale but limits independence; strategic decisions align with Hon Hai group priorities.
Supplies these inputs
Laptop Display Panels (LCD/OLED)
Replaceability
Substitutability 50% · 12 mo to replace
Business segments
Kioxia Holdings Corporation (formerly Toshiba Memory; Tokyo; ~¥1.5T revenue; co-owned by Bain Capital consortium and Toshiba) is the world's #2 NAND flash manufacturer with ~19% global market share. Kioxia co-invented NAND flash with Toshiba in 1987 and pioneered 3D BiCS FLASH (Bit Cost Scalable) stacking technology. Primary fabs: Yokkaichi complex (Mie Prefecture, K6 plant shared with Western Digital via Flash Ventures LLC JV) and Kitakami fab (Iwate Prefecture, Y7 plant, opened February 2024). IPO repeatedly delayed — planned 2020, then 2022, then postponed again amid NAND market downturn. Merger talks with Western Digital explored 2021-2022 and abandoned.
Supplies these inputs
NAND Flash Storage (SSD)
Replaceability
Substitutability 50% · 18 mo to replace
Business segments
Tokyo Ohka Kogyo Co., Ltd. (TOK; Kawasaki, Kanagawa; TSE: 4186; ~¥260B revenue) is Japan's third-largest EUV photoresist manufacturer, holding approximately 15-20% of the global EUV photoresist market. TOK's primary EUV resist production is at its Kanagawa (Kawasaki) plant. TOK operates the TAJRC (Tama Advanced Research Joint Center) in Tama, Tokyo — a next-generation resist development laboratory focused on High-NA EUV and metal-oxide resist chemistries. TOK's fluorinated polyimide was one of the three chemicals targeted in Japan's July 2019 export controls on South Korea. Also produces chemical mechanical planarization (CMP) slurries and developer chemicals for semiconductor fabs.
Supplies these inputs
EUV Photoresist
Replaceability
Substitutability 12% · 20 mo to replace
Business segments
Samsung SDI Co., Ltd. (Yongin, Gyeonggi-do, South Korea; KRX: 006400; ~KRW 20T revenue) is the battery manufacturing arm of the Samsung Group, producing cylindrical, prismatic, and pouch lithium-ion cells for consumer electronics (smartphones, laptops, tablets), power tools, and electric vehicles. In the consumer electronics LCO cell segment, Samsung SDI holds approximately 15-18% global market share. Samsung SDI manufactures LCO pouch cells at its Tianjin, China facility (primarily for smartphone applications) and cylindrical cells at Cheonan, South Korea. Samsung SDI is a co-supplier of Apple iPhone battery cells alongside ATL — Apple's dual-sourcing strategy for iPhones is the most sophisticated single-input procurement program in consumer electronics. Samsung SDI's EV battery business (NMC prismatic cells for BMW iX, Rivian, Stellantis) is growing faster than its consumer electronics segment.
Supplies these inputs
Lithium-Ion Battery Cells (Li-Co/NMC)
Replaceability
Substitutability 25% · 18 mo to replace
Business segments
Where it's made
47 facilities producing inputs that feed computers and laptops.
ASML · Veldhoven, North Brabant, Netherlands · manufacturing
The sole facility where EUV and High-NA EUV lithography machines are assembled. Each machine ships in 40 freight containers and requires ~1 year to install and qualify at customer sites. No second-source exists.
ATL (Amperex Technology Limited) · Guangdong · manufacturing
ATL's primary LCO battery cell manufacturing campus in Dongguan, Guangdong Province, China. Dongguan is the world's most concentrated single location for consumer electronics battery production — multiple ATL facilities occupy the Dongguan campus, employing tens of thousands of workers. The campus produces LCO pouch cells primarily for iPhone (Apple), Huawei, and other smartphone OEMs. Exact capacity is not publicly disclosed. A significant majority of global smartphone LCO cells originate within this one Chinese city. Source: https://www.atlbattery.com/en/about.html
AU Optronics (AUO) · Taoyuan · fab
AUO's Gen 8.5 (2200×2500mm) fab in Longtan, Taoyuan. Primary production site for premium gaming laptop panels (144Hz+ refresh rate, QHD/UHD resolution) and professional display-grade laptop screens. Approximately 90,000 glass substrates/month capacity. AUO's most advanced laptop LCD fab — produces the panels that command premium pricing segments where BOE's cost advantage is less decisive. Source: https://www.auo.com/en-global/About_AUO/Manufacturing_Locations
Ajinomoto Fine-Techno · Kawasaki, Kanagawa, Japan · materials-manufacturing
Primary ABF film production facility. ~90-95% of all advanced CPU/GPU substrate film produced here. Capacity expansions announced: JPY 25B investment by 2030 to meet AI chip demand.
Ajinomoto Fine-Techno · Kanagawa · manufacturing
Primary ABF film production; Ajinomoto Fine-Techno supplies ~95% of global ABF raw film from this Kawasaki/Kanagawa facility. Annual capacity ~10M m². Multiple expansion rounds in 2021–2024 due to AI-driven shortage.
BOE Technology Group · Hefei, Anhui Province · display_fab
World's largest LCD panel fab by generation; Gen 10.5 produces TV-size panels cut down for laptop/monitor use. Massive scale advantage enables BOE to undercut Korean rivals.
BOE Technology Group · Hubei · fab
BOE's B10 Gen 10.5 (2940×3370mm) fab in Wuhan, Hubei Province. One of the world's largest display fabs by glass substrate size — Gen 10.5 glass primarily targets TV panels but also high-volume laptop and monitor LCDs from cut-down substrate economics. Wuhan is one of China's three display manufacturing hubs (alongside Chengdu and Chongqing). Wuhan's lockdown from January 23 through April 8, 2020 — 76 days — directly affected BOE's display production timing during the COVID-19 outbreak. Source: https://www.boe.com/en/about/facility.html
CXMT (ChangXin Memory Technologies) · Hefei, Anhui · fab
CXMT (ChangXin Memory Technologies) Hefei fab — China's primary DRAM manufacturing facility, producing approximately 100,000-120,000 wafer starts per month as of 2024-2025 (compared to ~1.2M wspm total global DRAM capacity). CXMT is limited to 17nm DDR4 and LPDDR4 — approximately 2-3 generations behind Samsung/Hynix/Micron's 1a/1b-nm class DRAM. The Hefei fab has received an estimated $15B in Chinese state subsidies through direct grants, tax incentives, and below-market equipment loans. US export controls (October 2022 and October 2023 rounds) specifically targeted semiconductor manufacturing equipment that would allow CXMT to advance beyond its current 17nm capability. CXMT cannot produce HBM of any generation. China's domestic DRAM represents approximately 5-8% of global commodity DRAM capacity by volume, but zero HBM capacity. Source: https://www.trendforce.com/news/2024/06/05/news-cxmt-expands-dram-output-but-remains-generationally-behind/
DuPont Electronics (DuPont de Nemours) · Massachusetts · manufacturing
DuPont Electronics' Marlborough, Massachusetts facility is the primary U.S. EUV photoresist manufacturing site — one of the very few EUV resist manufacturing locations outside Japan. The facility traces its origins to Shipley Company (acquired by Rohm and Haas 1999; acquired by DuPont 2009) which was a photoresist pioneer in the Boston area. DuPont Marlborough produces both ArF and EUV photoresist variants qualified at Intel advanced nodes and available to fabs seeking to diversify away from Japanese supply. Source: https://www.dupont.com/electronics/semiconductor-technologies/photolithography.html
Fujifilm Holdings · Shizuoka Prefecture · manufacturing
Fujifilm's Yoshida-Minami facility in Shizuoka Prefecture is the primary production site for Fujifilm's semiconductor photoresist and electronic materials. Shizuoka Prefecture sits in the Tokai seismic gap — a region where the Philippine Sea Plate subducts beneath Honshu, with a 70-80% probability of a major Tokai earthquake (M8+) within 30 years according to Japan's Headquarters for Earthquake Research Promotion. A Tokai event would be one of the most consequential seismic scenarios for global semiconductor supply chains given the concentration of semiconductor chemical facilities in the region. Source: https://www.fujifilm.com/us/en/business/electronic-materials
Ibiden · Ogaki, Gifu Prefecture · substrate_manufacturing
Primary high-end ABF substrate fab for Intel, AMD, Nvidia CPUs. New capacity added 2023-2025 with METI subsidy support.
Ibiden · Gifu · manufacturing
Ibiden's primary IC substrate manufacturing cluster in Ogaki and surrounding Gifu Prefecture; sole high-end ABF substrate supplier for NVIDIA AI GPU lineup.
Innolux Corporation · Tainan · fab
Innolux's primary manufacturing complex in Tainan Science Park, Southern Taiwan. Multiple fab generations (Gen 6, Gen 7.5, Gen 8.5) producing laptop LCD panels across the full price range. Innolux was founded as Innolux Display from Foxconn's display ambitions; merged with Chi Mei Optoelectronics (also Tainan-based) to form current Innolux in 2010. The combined Tainan complex is the world's largest single-city concentration of non-OLED laptop display production. Innolux panels are used in MacBook Air models. Source: https://www.innolux.com/en/about.html
Inpria (JSR Inpria) · Oregon · manufacturing
Inpria's Corvallis, Oregon facility is the world's only commercial-scale manufacturing site for metal-oxide (tin-oxide) EUV photoresist — a next-generation resist chemistry that replaces traditional organic chemically amplified resists for High-NA EUV patterning. Acquired by JSR Corporation in 2023 for approximately $514M. This facility represents the sole commercial source of the resist chemistry required for ASML's High-NA EUV (EXE:5000) scanners at sub-2nm logic nodes. The entire pipeline of High-NA EUV patterning — from ASML's $380M machine to the world's most advanced chips — depends on materials produced at this single Oregon facility. Source: https://www.inpria.com
Intel Foundry (IFS) · County Kildare · fab
Intel Fab 34, Leixlip, County Kildare Ireland — Intel's primary European advanced logic fab. Produces Intel 4 process node (equivalent to TSMC N5-class EUV) for Intel's Meteor Lake CPU tiles. Intel 4 is Intel's first EUV-enabled process node, entering volume production 2023. Fab 34 represents a €17B investment. Intel is expanding further in Ireland (Fab 34 expansion and potential Fab 36). Source: https://www.intel.com/content/www/us/en/newsroom/news/intel-fab-34-ireland.html
JL MAG Rare-Earth · Jiangxi Province · manufacturing
JL MAG primary sintered NdFeB magnet plant in Ganzhou, Jiangxi — center of China's heavy rare earth industry (Dy, Tb sourced locally). 25,000 tonnes/year capacity; N54-grade magnets for EV motors. Source: https://rareearthexchanges.com/news/jl-mag-rare-earth-co-ltd-chinas-magnet-heavyweight-built-for-the-electric-age/
JSR Corporation · Mie Prefecture · manufacturing
JSR's primary photoresist manufacturing facility in Yokkaichi, Mie Prefecture, Japan. Produces JSR's EUV photoresist portfolio including ArF immersion resists and the full EUV chemical lineup. Yokkaichi is JSR's historic industrial base — the company's original synthetic rubber operations were located here. The facility co-located photoresist synthesis, purification, and quality control operations to minimize contamination risk. A contamination event or disruption at Yokkaichi would affect ~30-35% of global EUV photoresist supply immediately. Source: https://www.jsr.co.jp/en/aboutjsr/ir/
Kioxia Holdings · Yokkaichi, Mie Prefecture · fab
Kioxia Yokkaichi complex (Mie Prefecture) is the world's most unique large-scale semiconductor manufacturing arrangement: the K6 plant (and earlier Yokkaichi buildings) is a 50/50 joint venture between Kioxia and Western Digital, operated through Flash Ventures LLC. Both companies share cleanroom space, process technology, wafer starts, and equipment within the same physical fab — an arrangement with no parallel in the industry. The Yokkaichi complex has grown through multiple generations (Y1-Y6 buildings) since 1992 (originally Toshiba Memory). Yokkaichi K6 produces BiCS FLASH at 162-218 layer generations. Combined Yokkaichi+Kitakami capacity: ~330,000 NAND wspm representing approximately 33% of global NAND supply. A single seismic or fire event at Yokkaichi would simultaneously reduce Kioxia and Western Digital output — two separate companies — by roughly 33% of global NAND in one event. Source: https://www.nikkei.com/article/DGXZQOUF074KI0X00C22A6000000/
LG Display · Gyeonggi · fab
LG Display's primary manufacturing complex in Paju, Gyeonggi Province, South Korea. Houses P8 (Gen 8 LCD), P9 (Gen 8 OLED), and P10 (Gen 10.5 hybrid LCD/OLED) fabs. Paju is the world's largest OLED panel production site. The P10 OLED line produces the large-format OLED panels used in premium laptop displays (MacBook Pro 14"/16" OLED, Dell XPS OLED). LGD's IPS LCD technology ('In-Plane Switching,' originally developed at Hitachi and licensed to LG) originated here and remains the technology standard for premium non-OLED laptop panels. Source: https://www.lgdisplay.com/eng/about/production
LG Energy Solution, Ltd. · North Chungcheong · manufacturing
LG Energy Solution's Ochang, North Chungcheong Province campus produces consumer LCO pouch cells alongside cylindrical EV cells. Ochang is LGES's primary domestic manufacturing hub with multiple cell format lines. Consumer electronics LCO cell production at Ochang is declining as LGES prioritizes EV battery contracts over lower-margin consumer segments. The site also hosts LGES's small-format cylindrical cell lines for power tools and e-bikes. Source: https://www.lgensol.com/en/about/global_network
MP Materials Corp. · Fort Worth, TX · manufacturing
MP Materials NdFeB magnet manufacturing facility in Fort Worth, Texas; restoring first U.S. commercial NdFeB magnet production in decades. Phase 1: commercial NdPr metal complete. Phase 2: automotive-grade sintered NdFeB magnets ramping late 2025. Target: ~1,000 MT/year. Primary customer: General Motors. Planned $1.25B 'Northlake' expansion to 1,500+ direct jobs. Source: https://investors.mpmaterials.com/investor-news/news-details/2025/MP-Materials-Restores-U.S.-Rare-Earth-Magnet-Production/default.aspx
Micron Technology · Boise, Idaho · fab
Micron's Boise, Idaho headquarters and primary US DRAM manufacturing and R&D facility — the only advanced DRAM fab on US soil operated by a US company. Micron's Boise fab (MU-1) focuses on leading-edge DRAM process development (1a/1b-nm class) and some volume production, but the majority of Micron's high-volume commodity DRAM production occurs in Singapore. Boise is strategically critical as the home of Micron's DRAM process technology IP. CHIPS Act: Micron received $6.1B in grants (April 2024) for domestic expansion at Boise and at a new greenfield fab in Clay, New York. The Clay NY fab (announced 2022) will be the largest DRAM fab ever built in the US, targeting 1b-nm class DRAM and HBM when fully ramped by 2030. Source: https://investors.micron.com/news-releases/news-release-details/biden-harris-administration-announces-6-billion-chips-act
Micron Technology · Boise, Idaho · semiconductor_fab
Micron's flagship U.S. manufacturing facility; produces DRAM and NAND; expanding with $15B CHIPS Act investment for new fabs through 2030.
Micron Technology · Higashihiroshima, Hiroshima Prefecture · fab
Micron's Hiroshima, Japan 300mm fab (inherited from Elpida Memory acquisition for $2.5B in 2013, when Elpida went bankrupt) produces both NAND flash and DRAM for Micron. The Hiroshima facility gives Micron a significant Japan manufacturing presence. Capacity approximately 90,000-100,000 NAND wspm (with DRAM sharing some capacity). The fab received Japanese government METI subsidies under Japan's semiconductor sovereignty initiative (~¥46.5B). Micron announced further Hiroshima investment in 2023 supported by Japanese government aid. Source: https://investors.micron.com/news-releases/news-release-details/micron-announces-government-approved-subsidies-hiroshima-japan
Murata Manufacturing · Fukushima Prefecture · manufacturing
Murata's battery manufacturing facility in Koriyama, Fukushima Prefecture — the former Sony Energy Devices Corporation plant acquired by Murata in 2017. This is the site where Sony continued lithium cobalt oxide battery production after inventing the LCO cell chemistry in 1991. The facility now produces small-format LCO cells (thin, flexible, coin formats) for wearables, hearing aids, and IoT under Murata branding. Koriyama is also the location of AGC Electronics' EUV photomask blank plant — coincidentally making Koriyama a concentration point for two entirely unrelated critical supply chains. Source: https://www.murata.com/en-us/about/newsroom/news/product/battery/2017/0801
Panasonic Energy Co., Ltd. · Hyogo Prefecture · manufacturing
Panasonic Energy's Kasai, Hyogo Prefecture facility produces consumer-grade lithium-ion cells including LCO prismatic and cylindrical formats for laptop computers, tablets, and Panasonic industrial devices. This is distinct from Panasonic's EV battery gigafactory in Sparks, Nevada (NCA cells for Tesla) — the Kasai plant handles the traditional Japanese consumer electronics battery business. Kasai is one of Panasonic's oldest battery manufacturing sites, with lineage tracing to Matsushita Electric battery operations. Source: https://panasonic.net/cns/energy/company/base.html
SK Hynix · Cheongju, North Chungcheong · fab
SK Hynix M15X fab (Cheongju, North Chungcheong Province, Korea) is SK Hynix's primary domestic NAND flash manufacturing facility. M15X produces 128-238 layer NAND and is the production home for SK Hynix's enterprise NAND chips. Cheongju is a 300mm fab with capacity approximately 100,000-120,000 NAND wspm. SK Hynix is expanding Cheongju for NAND as DRAM production shifts to Icheon (for HBM). Source: https://www.skhynix.com/eng/about/offices.do
SK Hynix · Icheon, Gyeonggi · semiconductor_fab
Primary DRAM manufacturing site; M16 produces LPDDR5 and HBM3. Icheon campus is the global center for SK Hynix memory R&D and advanced production.
SK Hynix · Icheon, Gyeonggi-do · fab
SK Hynix's Icheon M16 fab — the world's primary HBM3e production facility and the most consequential DRAM fab for global AI infrastructure. M16 is SK Hynix's most advanced DRAM production line (1a/1b-nm class) and the site where HBM3e — the memory variant required by NVIDIA H100 and H200 AI accelerators — was first produced at volume. In 2023, all HBM3e chips in the world came from this facility; NVIDIA was on a multi-year waitlist. M16 also produces leading-edge DDR5 and LPDDR5X. Icheon campus capacity: M14 + M16 together represent approximately 280,000 wafer starts per month. SK Hynix is building M15X expansion and a new fab at Cheongju (NAND). Source: https://news.skhynix.com/sk-hynix-completes-the-construction-of-m16-fab-the-worlds-most-advanced-dram-production-facility/
Semiconductor Manufacturing International Corporation (SMIC) · Beijing · fab
SMIC's Beijing fab (SMIC SZ/SN joint venture with Beijing government) — produced the Kirin 9000s chip for Huawei Mate 60 Pro using a '7nm-equivalent' N+2 DUV multi-patterning process (revealed September 2023). This was a strategic shock to Western intelligence: SMIC achieved ~7nm-class performance without EUV, which US/Dutch export controls were designed to prevent. However, SMIC's DUV-based 7nm has significantly lower yields (~40-50% vs TSMC ~80%+) and higher wafer cost, limiting competitiveness and volume. SMIC cannot progress to 5nm or below without EUV equipment it cannot legally obtain. Source: https://semianalysis.com/2023/09/08/smic-is-shipping-7nm-huawei-chips/
