Facility
TSMC AP3 Advanced Packaging Fab (Longtan)
TSMC AP3 in Longtan, Taoyuan; ~20,000 wspm CoWoS capacity; primarily serves Apple (iPhone SoC packaging) alongside AI accelerator work. One of TSMC's original advanced packaging sites; hosts WMCM (Wafer Multi-Chip Module) and InFO solutions. Source: https://www.nomadsemi.com/p/tsmcs-cowos-capacity
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