Producer
Taiwan Semiconductor Manufacturing Company (TSMC)
Taiwan Semiconductor Manufacturing Company (TWSE: 2330; founded 1987 by Morris Chang); the world's dominant pure-play foundry and the most critical single company in the global technology supply chain. TSMC manufactures approximately 90% of all sub-5nm logic chips globally, including every NVIDIA AI GPU (H100 on N4, H200 on N4X, B200 on N3E), every Apple processor (A18 on N3E, M4 on N3E), and every AMD data center chip. TSMC's N3 and N5 fabs are located in Taiwan — 100 miles from mainland China. Revenue: $93.7B (2024, +34% YoY). AI/HPC share of revenue: 57% (Q3 2025), up from 18% in 2019. N2 volume production began Q4 2025 at Fab 22 Kaohsiung — world's first 2nm logic node in production. TSMC Arizona Fab 21 Phase 1 (N4P) reached 92% yield and profitability in 2025. CHIPS Act recipient: $6.6B grant + $5B loan.
5
Inputs supplied
6
Goods downstream
16
Facilities
0
Stories
What they make
5 inputs Taiwan Semiconductor Manufacturing Company (TSMC) supplies
Click an input to see every good that depends on it, every country that produces it, and every other company in the supply chain.
manufactured
Sole supplierAI Training GPU (H100/H200/B200 class) →
manufactured
Advanced Logic Chips (CPU/SoC ≤5nm) →
manufactured
Sole supplierAdvanced Logic Wafer (TSMC N3/N4) →
manufactured
Sole supplierCoWoS Advanced Packaging (TSMC) →
manufactured
300mm Silicon Wafers →
Where it shows up
Goods downstream
Essential goods that depend on something Taiwan Semiconductor Manufacturing Company (TSMC) makes — pick one to see the full supply chain.
Where they make it
16 facilities
TSMC AP3 Advanced Packaging Fab (Longtan) →
TWTaoyuan · advanced packaging
TSMC AP3 in Longtan, Taoyuan; ~20,000 wspm CoWoS capacity; primarily serves Apple (iPhone SoC packaging) alongside AI accelerator work. One of TSMC's original advanced packaging sites; hosts WMCM (Wafer Multi-Chip Module) and InFO solutions. Source: https://www.nomadsemi.com/p/tsmcs-cowos-capacity
TSMC AP6 CoWoS Packaging Fab (Chiayi) →
TWChiayi · advanced packaging
New CoWoS fab opened 2024; part of TSMC's expansion of advanced packaging to 75K wafers/month by 2026 to meet NVIDIA Blackwell and future AI demand.
TSMC Advanced Packaging AP6 (Zhunan, Miaoli) →
TWMiaoli · packaging
TSMC AP6 in Zhunan, Miaoli; integrates SoIC (System on Integrated Chips), InFO, CoWoS, and testing. Fully operational as of late 2024; became the primary catalyst for the 2024-2025 CoWoS capacity surge. Key hub for NVIDIA Blackwell-era packaging. Source: https://www.trendforce.com/news/2025/01/02/news-tsmc-set-to-expand-cowos-capacity-to-record-75000-wafers-in-2025-doubling-2024-output/
TSMC Advanced Packaging AP7 (Chiayi) →
TWChiayi · packaging
TSMC AP7 in Chiayi; Phase 1 and 2 planned for CoWoS, WMCM, SoIC, and CoPoS. Equipment installation delayed by discovery of an archaeological site on the construction footprint (2024-2025); production now targeting 2026-2027. This archaeological-delay incident was publicly noted as a factor in 2025 CoWoS tightness. 96,000+ sq meter facility once complete. Source: https://www.trendforce.com/news/2025/12/04/news-tsmc-speeds-advanced-packaging-ap7-targets-2026-output-arizona-p6-eyed-for-u-s-packaging-hub
TSMC Advanced Packaging AP8 (Tainan) →
TWTainan · packaging
TSMC AP8 in Tainan (acquired from Innolux display panel facility); 96,000+ sq meters — one of TSMC's largest advanced packaging sites, ~9x larger than AP6. Currently ramping. Will substantially increase total CoWoS capacity toward 120-130K wspm target by late 2026. Source: https://markets.financialcontent.com/stocks/article/tokenring-2026-2-5-tsmc-to-quadruple-advanced-packaging-capacity-reaching-130000-cowos-wafers-monthly-by-late-2026
TSMC Arizona Fab (Fab 21) →
USPhoenix, Arizona · logic_fab_advanced
TSMC's first US advanced fab. Fab 21 Phase 1 (N4 node) entered production 2024; Phase 2 (N2) targeted 2028. Receiving $6.6B CHIPS Act grants. US capacity currently <5% of TSMC's total. TSMC has committed $165B total US investment through 2030.
TSMC Arizona P6 Advanced Packaging Site (Phoenix) →
USArizona · packaging
TSMC Arizona Phase 6 site in Phoenix eyed as first U.S. CoWoS advanced packaging hub. Equipment installation deferred to end of 2027; earliest pre-production possible 2028. NOT currently producing CoWoS — the '5% US share' in earlier estimates is aspirational. First U.S.-soil CoWoS capacity would complete American AI chip supply chain independence. Source: https://www.trendforce.com/news/2025/12/04/news-tsmc-speeds-advanced-packaging-ap7-targets-2026-output-arizona-p6-eyed-for-u-s-packaging-hub
TSMC CoWoS Advanced Packaging Taichung →
TWTaichung, Taiwan · semiconductor fab
TSMC CoWoS-S and CoWoS-R advanced packaging for AI GPUs; silicon interposer manufacturing; near-monopoly for NVIDIA H100/H200/B200 packaging; capacity constrained 2023-24 driving AI chip shortage
TSMC Fab 18 (Tainan) — AMD EPYC CPU Production →
TWTainan · manufacturing
AMD EPYC Genoa (N5) and Turin (N4P/N3) server CPUs fabbed exclusively at TSMC Fab 18; same fab as NVIDIA H100/H200 GPUs — AMD server CPU production competes with AI GPU production for TSMC allocation.
TSMC Fab 18 (Tainan) — N3/N4 Gigafab →
TWTainan · fab
TSMC Fab 18, Southern Taiwan Science Park, Tainan — an 8-phase gigafab covering approximately 160,000 square meters (22 soccer fields). Primary production: N3 (3nm) and N4 (4nm EUV) nodes. Capacity: 150,000–160,000 wafer starts per month (wspm). This is the single most consequential industrial building on Earth for AI hardware — every NVIDIA H100, H200, and Blackwell GPU compute die was manufactured here. Fab 18 is located in an active seismic zone. April 3, 2024: M7.4 earthquake (Hualien) caused temporary disruptions to cleanroom operations; estimated 2–3 weeks partial recovery. December 2025: M7.0 earthquake — Taiwan's strongest in 27 years — Fab 18 escaped with minimal disruption due to extraordinary engineering safeguards. Source: https://www.usgs.gov/news/national-news-release/major-79-earthquake-strikes-taiwan
TSMC Fab 20 (Hsinchu) — N2 Pilot/Ramp →
TWHsinchu · fab
TSMC Fab 20 in Baoshan, Hsinchu; N2 pilot production established 2025; targeting 130,000 wspm combined with Fab 22 by end-2026. R&D and pilot production complement Fab 22's volume ramp. Source: https://www.trendforce.com/news/2025/01/01/news-tsmc-sets-up-2nm-pilot-line-aims-for-130000-wafers-monthly-by-2026/
TSMC Fab 21 (Chandler, Arizona) — N4P / N3 →
USArizona · fab
TSMC Fab 21, Chandler, Arizona — TSMC's first advanced logic fab on US soil. Phase 1 (N4P): 10,000–30,000 wspm; reached 92% yield and profitability in 2025, outperforming TSMC's Taiwan fabs at the same node — confounding critics who predicted uncompetitive US-manufactured chips. Phase 2 (N3, 50,000 wspm target): equipment installation Q3 2026, production H2 2027. CHIPS Act: $6.6B grant + $5B loan. First US-manufactured advanced node AI chips rolled out 2025. Source: https://markets.financialcontent.com/wral/article/tokenring-2025-12-31-the-tale-of-two-fabs-tsmc-arizona-hits-profitability-while-intel-ohio-faces-decade-long-delay
TSMC Fab 21 Phase 2 (Arizona) — N3 →
USArizona · fab
TSMC Arizona Fab 21 Phase 2 (N3 node); equipment installation Q3 2026; production H2 2027 (accelerated from H2 2028). Target capacity: 50,000 wspm (30K N3 + 20K N5). Will represent ~25% of global N3 capacity when fully ramped. Phase 1 (N4P) reached 92% yield and profitability in 2025 with 10-30K wspm. Source: https://www.trendforce.com/news/2025/09/30/news-tsmc-reportedly-pulls-arizona-third-fab-to-2027-ahead-by-one-year-eyeing-2nm-and-a16/
TSMC Fab 22 (Kaohsiung) — N2 Volume Production →
TWKaohsiung · fab
TSMC Fab 22, Kaohsiung Science Park — entered N2 (2nm GAA, gate-all-around) volume production Q4 2025, the world's first 2nm logic node in volume production. Capacity trajectory: 40K → 100K → 200K wspm (2025–2027). All 2026 N2 capacity is completely pre-sold at ~50% premium over N3. First major N2 customers: Apple (M6/A19 chipsets) and eventually NVIDIA Rubin GPUs. Source: https://www.techspot.com/news/110755-tsmc-2nm-n2-process-officially-enters-volume-production.html
TSMC Hsinchu Gigafab Complex →
TWHsinchu Science Park · semiconductor_fab
Original TSMC campus; runs N5/N7/N16 nodes; R&D center for N2 (2nm) development; GigaFab cluster with >10 fab buildings.
TSMC Hsinchu Science Park (Fab 12, 18) →
TWHsinchu, Taiwan · logic_fab_advanced
TSMC's most advanced logic fabs. Fab 18 (N3/N2 production) in Hsinchu. Fab 12 handles N5/N4. Together, TSMC's Taiwan fabs produce ~92% of the world's sub-5nm logic chips. A Taiwan Strait conflict or blockade that shut TSMC Taiwan would remove the ability to manufacture leading-edge chips for Apple, Nvidia, AMD, and Qualcomm within weeks.
What else they do
Business segments
The company's full revenue map — where this supply-chain role fits within their broader business.
Advanced Logic Foundry (<7nm)
65%Specialty Technology (Mature Nodes)
20%Advanced Packaging (InFO, CoWoS)
10%Global Expansion Fabs
5%
Intelligence
What's known
Sourced claims about this company's role in supply chains — chokepoints, concentration, incidents, dual-use connections.
Did you know2023
TSMC manufactures chips for both the US commercial AI industry and the US military simultaneously — and neither can currently substitute TSMC. NVIDIA H100/H200 AI accelerators (the primary compute used for training every major AI model) are manufactured exclusively at TSMC N4/N3. Simultaneously, TSMC processes used in advanced US defense systems include the F-35 avionics computer (Northrop Grumman processors), JDAM precision guidance electronics, and Tomahawk missile navigation. A Taiwan conflict that disabled TSMC fabs would simultaneously halt: (1) commercial AI model training and inference at every major tech company, (2) Apple iPhone production, (3) AMD and NVIDIA chip supply, (4) US military electronics supply chains. The US Department of Defense has publicly acknowledged TSMC as critical defense infrastructure — but the Pentagon chips are manufactured on the same Taiwanese island that US Indo-Pacific Command is responsible for defending. Defense demand and defense risk are concentrated at the same physical location.
TSMC ↗Chokepoint2023
TSMC explicitly requires that its most advanced process nodes (N3 and below) can only be manufactured using ASML EUV (extreme ultraviolet) lithography machines — of which ASML is the world's only manufacturer. This creates a two-layer chokepoint stack: TSMC dominates advanced logic foundry (90% share), and ASML monopolizes the equipment TSMC requires to operate (100% share of EUV). If either node in this stack is disrupted — TSMC fab or ASML supply — global advanced chip production halts. The Netherlands government, under US pressure, has banned ASML from exporting EUV machines to China since 2019 (and tightened to ban DUV exports below 200nm in 2023). This export control regime is the primary mechanism preventing China from achieving EUV-based sub-7nm production — and is implemented by one Dutch company's sales policies enforced by one European government. The entire US strategic semiconductor export control architecture ultimately rests on ASML's Veldhoven, Netherlands headquarters following Dutch government guidance.
ASML ↗Concentration2022
The 'silicon shield' theory holds that Taiwan's role as the irreplaceable manufacturer of 90%+ of the world's advanced logic chips provides a unique geopolitical deterrence: any military attack on Taiwan that damaged TSMC's fabs would simultaneously collapse the global economy, eliminate the semiconductor supply for the US military-industrial complex, and destroy China's own access to advanced chips used in Chinese smartphones, data centers, and military electronics — creating a mutual assured economic destruction scenario that, in theory, deters Chinese military action. TSMC chairman Mark Liu explicitly articulated this theory in a CNN interview (August 2022): 'Nobody can control TSMC by force. If you take a military action on Taiwan... the fabs will stop working... the world economy will be severely damaged.' Taiwan has also adopted a deliberate policy of NOT dispersing TSMC's advanced fabs internationally to preserve the deterrence value of the silicon shield. TSMC's global dispersal (Arizona, Japan, Germany) has been pushed primarily by US government pressure — over TSMC's own resistance.
CNN ↗Origin2023
Morris Chang founded TSMC in 1987 after being passed over for the CEO position at Texas Instruments and returning to Taiwan at age 55. The Taiwan government and Philips provided the initial capital. Chang's founding insight was radical: semiconductor manufacturing required such massive capital investment that most chip designers would be better off outsourcing fabrication entirely — if a trusted, neutral manufacturer existed. Before TSMC, every chip company (Intel, TI, Motorola) designed and made their own chips. TSMC's pure-play foundry model created the fabless semiconductor industry: Qualcomm (1985, but broke until TSMC), NVIDIA (1993), AMD (went fabless in 2009), and ultimately Apple Silicon (2020) only exist as they do because a 55-year-old former TI executive decided to build a neutral chip factory in Taiwan. The entire AI hardware supply chain — NVIDIA H100, AMD MI300, Google TPU — runs through a company founded with Taiwan government capital in the late Cold War period.
TSMC ↗