Facility

TSMC Advanced Packaging AP6 (Zhunan, Miaoli)

TSMC AP6 in Zhunan, Miaoli; integrates SoIC (System on Integrated Chips), InFO, CoWoS, and testing. Fully operational as of late 2024; became the primary catalyst for the 2024-2025 CoWoS capacity surge. Key hub for NVIDIA Blackwell-era packaging. Source: https://www.trendforce.com/news/2025/01/02/news-tsmc-set-to-expand-cowos-capacity-to-record-75000-wafers-in-2025-doubling-2024-output/