Facility
TSMC CoWoS Advanced Packaging Taichung
Operated by Taiwan Semiconductor Manufacturing Company (TSMC) →TW · Taichung, Taiwansemiconductor fab
TSMC CoWoS-S and CoWoS-R advanced packaging for AI GPUs; silicon interposer manufacturing; near-monopoly for NVIDIA H100/H200/B200 packaging; capacity constrained 2023-24 driving AI chip shortage
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