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119-hr-6058119th CongressWALLET

STRIDE Act

Sponsored By: Representative Huizenga, Bill [R-MI-4]

In Committee

Summary

This bill would create a multilateral framework to protect critical semiconductor technologies from transfer to foreign adversaries. It directs the Secretary of State to coordinate with allied governments on aligned export controls, limits on design tools and IP transfers, controls on key materials, and creation of trusted supplier networks.

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  • Allied governments would be asked to align export controls on semiconductor manufacturing equipment and key subcomponents and to share information on transfer risks and end users.
  • U.S. companies and supply chains would get measures to harmonize rules on dual-use materials like photoresists and specialty gases and to reduce foreign backfilling that could enable rival semiconductor development.
  • For countries that do not cooperate, it would require a rapid response process with an Export Advisory Review Board action plan within 21 days and recurring diplomatic reports to Congress every 90 days.

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Bill Overview

Analyzed Economic Effects

3 provisions identified: 0 benefits, 0 costs, 3 mixed.

Defines semiconductor export terms

If enacted, the bill would define key terms that set the scope of semiconductor export controls. It would specify which congressional committees are "appropriate" and treat "countries of concern" by reference to 10 U.S.C. 4872(f). It would define the Entity List, a Foreign Direct Product Rule for items made abroad using U.S. technology, and what counts as "semiconductor technology" (chips, equipment, design software, materials, testing, and related services). These definitions would guide exporters, manufacturers, researchers, and agencies. The definitions would take effect upon enactment.

Diplomatic coordination and reporting

If enacted, the Secretary of State would lead talks with countries that have major semiconductor capabilities to align protections against the Chinese Communist Party and other adversaries. The Secretary would consult Commerce on regular assessments and must report to Congress not later than 90 days after enactment and every 90 days after that. Reports would be unclassified with an optional classified annex. If a country is not cooperating, the Secretary would explain deficiencies, ask Commerce to convene the Export Advisory Review Board to make and start a plan within 21 days, and notify congressional committees within 30 days. The Secretary would also recommend Entity List additions and Foreign Direct Product Rule steps to stop backfilling.

Joint rules for chip equipment and materials

If enacted, the bill would direct allied countries to coordinate protections for critical semiconductor technologies. Actions would include trusted supplier networks, shared export controls on a broad list of manufacturing equipment and subcomponents, tighter limits on design tools, IP transfers, equipment servicing, and technical assistance, and harmonized controls on dual‑use materials like photoresists and specialty gases. It would also create joint monitoring and enforcement to stop circumvention and foreign backfilling. These steps would affect suppliers, equipment makers, manufacturers, exporters, and enforcement agencies. The measures would take effect upon enactment.

Sponsors & CoSponsors

Sponsor

Huizenga, Bill [R-MI-4]

MI • R

Cosponsors

  • Del. Moylan, James C. [R-GU-At Large]

    GU • R

    Sponsored 11/17/2025

  • Rep. Crenshaw, Dan [R-TX-2]

    TX • R

    Sponsored 11/17/2025

  • Rep. Lawler, Michael [R-NY-17]

    NY • R

    Sponsored 11/21/2025

  • Rep. Shreve, Jefferson [R-IN-6]

    IN • R

    Sponsored 12/1/2025

Roll Call Votes

No roll call votes available for this bill.

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