Facility
ASE Kaohsiung CoWoP Packaging Facility
ASE Technology's primary CoWoP (Chip-on-Wafer-on-Panel) advanced packaging operation in Kaohsiung. Projected to reach 20,000-25,000 wspm by end 2025 (3x expansion). TSMC outsourcing 240K-270K wafers/year to ASE (and Amkor) starting 2026. Serves mid-tier AI ASIC packaging — not yet primary route for NVIDIA Blackwell-class. Source: https://www.trendforce.com/news/2025/12/08/news-tsmcs-cowos-l-s-reportedly-fully-booked-osat-partners-step-up-with-ases-cowop-in-focus
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Inputs produced
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Goods downstream
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Incidents on record
0
Stories
What's produced here
1 input from this facility
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