Digital

GPUs and AI accelerators

Graphics and AI compute chips for consumer gaming, professional visualization, and large-scale AI training.

Why it matters · Allocation constraints and extreme price premiums when AI and gaming demand overwhelm TSMC fab capacity.

12

Inputs

30

Companies

28

Facilities

10

Source countries

How it's made

The process

  1. 01

    Silicon Wafer Preparation

    300mm Czochralski-grown silicon wafers are polished to atomic-level flatness and cleaned in ultra-pure water. Wafers are semiconductor-grade (9N purity), sourced primarily from Shin-Etsu Chemical and Sumco (Japan), and shipped to TSMC's Tainan fabs.

  2. 02

    Advanced Logic Wafer Fabrication (Front-End)

    The GPU compute die is fabricated on TSMC's N4/N4P (FinFET) or N3/N3E (GAA) process nodes at Fab 18, Tainan Science Park. NVIDIA H100 uses TSMC 4N process (80B transistors, 814mm² die). Requires EUV lithography (ASML TWINSCAN NXE:3600D) for critical layers. Each wafer cycle takes ~3 months.

  3. 03

    HBM Stack Fabrication and TSV Etching

    High Bandwidth Memory dies are fabricated at SK Hynix (Icheon M16, Cheongju M15X), Samsung (Pyeongtaek P4), or Micron (Boise) using DRAM-specific process nodes. Vertical through-silicon vias (TSVs) are etched through each die. HBM3e stacks 8–12 DRAM dies on a base logic die using hybrid Cu-Cu bonding at sub-micron pitch.

  4. 04

    Silicon Interposer Fabrication (CoWoS)

    TSMC's CoWoS (Chip on Wafer on Substrate) advanced packaging integrates the GPU die and multiple HBM stacks on a silicon interposer or LSI bridge. CoWoS-S uses a full-reticle silicon interposer; CoWoS-L uses a localized silicon interconnect bridge. TSMC performs all CoWoS for NVIDIA HGX systems at Longtan (AP3) and Chiayi (AP6) packaging fabs.

  5. 05

    ABF Substrate Build-up and Flip-Chip Bonding

    The CoWoS assembly is flip-chip bonded to an organic build-up substrate. IC substrates use 15–20 layers of Ajinomoto Build-up Film (ABF) to route electrical connections from the chip's micro-bump pitch (~100µm) to PCB-compatible ball-grid array pitch (~1mm). Ibiden, Unimicron, and Shinko are primary substrate suppliers for NVIDIA AI GPUs.

  6. 06

    Assembly, Test & Known-Good-Die Screening

    Completed CoWoS assemblies undergo wafer-level burn-in and electrical test. Known-good die (KGD) are selected before assembly — critical because yield loss in a $3,000+ GPU die embedded with $1,800 of HBM is catastrophic. Final packaged GPUs are tested at temperatures from −40°C to 125°C.

  7. 07

    System Integration into HGX/SXM Modules

    Packaged AI GPUs are mounted onto HGX (server baseboards) or SXM5/SXM6 modules with NVLink interconnects, NVSwitch ASICs, TIM (thermal interface material), and copper vapor chamber heatsinks. Integration occurs at facilities operated by Foxconn, Quanta, Wistron, and Super Micro in Taiwan and the US.

  8. 08

    Export Compliance Screening and Logistics

    AI accelerators above US export control thresholds (A100/H100-class and above) require Bureau of Industry and Security license review for export to restricted destinations. NVIDIA and AMD maintain compliance teams that screen every shipment against Entity List and export control regulations that have been tightened in Oct 2022, Oct 2023, and Oct 2024.

Where it comes from

Country dependencies

Weighted share of upstream inputs sourced from each country.

CountryWeighted shareInputs supplied to gpus and ai accelerators
NLNetherlands100%EUV Lithography Scanner (ASML)
TWTaiwan69%ABF Substrate Film (Ajinomoto Build-up Film) · Advanced Logic Wafer (TSMC N3/N4) · CoWoS Advanced Packaging (TSMC)
CNChina65%Gallium (Primary, Refined) · Neon Gas (Chip-Grade)
JPJapan62%ABF Substrate Film (Ajinomoto Build-up Film) · EUV Photomask Blanks · Neon Gas (Chip-Grade) +2
CDDemocratic Republic of Congono map50%Refined Cobalt Metal · Tantalum Capacitors
KRSouth Korea23%Advanced Logic Wafer (TSMC N3/N4) · CoWoS Advanced Packaging (TSMC) · Gallium (Primary, Refined) +2
UAUkraine15%Neon Gas (Chip-Grade)
RWRwandano map15%Tantalum Capacitors
AUAustralia13%Refined Cobalt Metal · Tantalum Capacitors
BRBrazil12%Tantalum Capacitors

Who makes it

Supplier companies

30 companies in this supply chain, sorted by market share.

ASML Holding (ASML)
HQ NL100% shareSOLE SUPPLIER

ASML Holding N.V. (Nasdaq: ASML, Euronext: ASML); sole global manufacturer of EUV lithography scanners — 100% market share, no competitor within 10+ years. HQ and final assembly in Veldhoven, Netherlands. Manufactures only ~15% of scanner components internally; draws from 5,150+ global suppliers. TWINSCAN NXE series (low-NA, ~$183M): ~44-56 units/year. TWINSCAN EXE:5200 High-NA ($380M): 5-6 units/year currently, targeting 20/year by 2028. Record backlog €38.8B (Q4 2025); 18-24 month lead times. China dropped from 49% to ~20% of revenue after 2024 export controls. Owns 24.9% of Carl Zeiss SMT — its sole optics supplier.

Supplies these inputs

EUV Lithography Scanner (ASML)

Replaceability

Substitutability 0% · 18 mo to replace

Business segments

  • EUV Lithography Systems (Global Monopoly)55% rev
  • DUV Lithography Systems35% rev
  • Metrology, Inspection + Services10% rev
Ajinomoto Fine-Techno
HQ JP95% shareSOLE SUPPLIER

Subsidiary of Ajinomoto Group; sole commercial producer of ABF (Ajinomoto Build-up Film) used in ~95% of CPU and GPU substrates worldwide. ABF was invented from waste byproducts of MSG manufacturing.

Supplies these inputs

ABF Substrate Film (Ajinomoto Build-up Film)

Replaceability

Substitutability 5% · 36 mo to replace

Business segments

  • ABF (Ajinomoto Build-up Film) — Global Monopoly85% rev
  • Functional Materials (Electronic + Biomedical)15% rev

Taiwan Semiconductor Manufacturing Company (TWSE: 2330; founded 1987 by Morris Chang); the world's dominant pure-play foundry and the most critical single company in the global technology supply chain. TSMC manufactures approximately 90% of all sub-5nm logic chips globally, including every NVIDIA AI GPU (H100 on N4, H200 on N4X, B200 on N3E), every Apple processor (A18 on N3E, M4 on N3E), and every AMD data center chip. TSMC's N3 and N5 fabs are located in Taiwan — 100 miles from mainland China. Revenue: $93.7B (2024, +34% YoY). AI/HPC share of revenue: 57% (Q3 2025), up from 18% in 2019. N2 volume production began Q4 2025 at Fab 22 Kaohsiung — world's first 2nm logic node in production. TSMC Arizona Fab 21 Phase 1 (N4P) reached 92% yield and profitability in 2025. CHIPS Act recipient: $6.6B grant + $5B loan.

Supplies these inputs

Advanced Logic Wafer (TSMC N3/N4) · CoWoS Advanced Packaging (TSMC)

Replaceability

Substitutability 5% · 36 mo to replace

Business segments

  • Advanced Logic Foundry (<7nm)65% rev
  • Specialty Technology (Mature Nodes)20% rev
  • Advanced Packaging (InFO, CoWoS)10% rev
  • Global Expansion Fabs5% rev
AGC Inc. (5201.T)
HQ JP57% share

Japanese glass and chemicals conglomerate (TSE: 5201, formerly Asahi Glass); world's largest EUV photomask blank supplier by revenue (~55-59% market share). EUV blank production via 100%-owned subsidiary AGC Electronics Co., Ltd. at Koriyama, Fukushima, Japan (production started January 2022; 30% capacity expansion January 2024; ¥40B+ sales target by 2025). Unrelated businesses in same parent: automotive glass (world #1 market share), architectural/float glass, pharmaceuticals and agrochemical active ingredients, life sciences. Same company that makes your car windshield also makes the blank every EUV photomask starts from.

Supplies these inputs

EUV Photomask Blanks

Replaceability

Substitutability 10% · 24 mo to replace

Business segments

  • EUV Photomask Blanks (#1 Global, ~55-59% Share)8% rev
  • Automotive Glass (World #1)30% rev
  • Architecture & Float Glass25% rev
  • Fluorine Chemistry & Life Sciences22% rev
SK Hynix (HXSCL)
HQ KR57% share

SK Hynix Inc. (KRX: 000660; ~₩66T revenue) is the world's #3 NAND flash manufacturer with ~18% global market share — a position significantly strengthened by its $9B acquisition of Intel's NAND business (completed December 2021), which created the Solidigm subsidiary (formerly Intel NAND) and added the Dalian, China fab. SK Hynix's primary domestic NAND production is at the Cheongju M15X fab (North Chungcheong Province, Korea). SK Hynix is also the world's dominant HBM (High Bandwidth Memory) manufacturer, supplying all of NVIDIA's H100/H200/B200 memory.

Supplies these inputs

HBM (High Bandwidth Memory) Stack

Replaceability

Substitutability 10% · 36 mo to replace

Business segments

  • DRAM (World #2)45% rev
  • High Bandwidth Memory — HBM (Dominant Supplier)25% rev
  • NAND Flash (World #3)20% rev
  • Advanced Packaging + AI Infrastructure10% rev
Ibiden (IBIDF)
HQ JP40% share

Japan's leading manufacturer of high-end ABF flip-chip BGA substrates for Intel, AMD, and Nvidia CPUs and GPUs. Dominant player alongside Shinko Electric; both received Japanese government subsidies to expand capacity.

Supplies these inputs

ABF Substrate Film (Ajinomoto Build-up Film)

Replaceability

Substitutability 10% · 18 mo to replace

Business segments

  • FC-BGA Semiconductor Package Substrates (World #1)55% rev
  • Diesel Particulate Filters (DPF)20% rev
  • Graphite and Carbon Products15% rev
  • Printed Circuit Boards10% rev

Japanese optical and electronics conglomerate (TSE: 7741); one of only two global EUV photomask blank manufacturers, holding ~35-38% overall market share but 75%+ of the High-NA EUV segment — the only validated supplier for sub-2nm logic nodes as of Q1 2025. Primary EUV blank production at Kumamoto, Japan; expanded by 3M units/year (2023) and 2.5M units/year (Feb 2024). Also operates in: contact lenses, eyeglass lenses, intraocular lenses for cataract surgery, medical flexible endoscopes, artificial bone/joint implants. These businesses are entirely unrelated to semiconductors yet share the same parent company.

Supplies these inputs

EUV Photomask Blanks

Replaceability

Substitutability 10% · 24 mo to replace

Business segments

  • EUV Photomask Blanks (75%+ High-NA Segment)12% rev
  • Intraocular Lenses for Cataract Surgery (World Leader)20% rev
  • Contact Lenses (Everyday Vision)20% rev
  • Eyeglass Lenses (Prescription Optics)25% rev
JSR Corporation
HQ JP27% share

JSR Corporation (Tokyo; formerly JASDAQ/TSE: 4185; now private after delisting following Japan Investment Corporation nationalization in 2023) is Japan's leading life science materials company and manufacturer of Amsphere A3 Protein A affinity resin — one of the fastest-growing Protein A resin brands. JSR's Amsphere A3 uses a novel polymer bead architecture (highly cross-linked polymethacrylate) with proprietary recombinant Protein A ligand — designed for high dynamic binding capacity and long resin lifetime. In April 2023, the Japanese government's sovereign industrial fund INCJ (Innovation Network Corporation of Japan, now JIC) acquired a majority stake in JSR Corporation and took it private — an extraordinary step justified by JSR's dual strategic importance in semiconductor photoresists (JSR is the world's #2 photoresist producer, supplying TSMC and Samsung) and bioprocess materials (Amsphere A3). Japan explicitly nationalized JSR to prevent acquisition by non-Japanese parties and to secure domestic control of critical semiconductor and bioprocess supply chains — a template for strategic industry policy that no other major economy had applied to a life science materials company.

Supplies these inputs

Specialty Semiconductor Process Chemicals

Replaceability

Substitutability 10% · 24 mo to replace

Business segments

  • Semiconductor Photoresists (World #2)45% rev
  • Bioprocess Materials (Protein A + Life Science)20% rev
  • Synthetic Rubber (Original Business)25% rev
  • Display + Other Materials10% rev
Linde plc (LIN)
HQ IE22% share

Linde plc (NYSE/FWB: LIN; HQ Dublin, Ireland; operational HQ Guildford UK; ~$32B revenue 2023) is the world's largest industrial gas company. Linde owns and operates one of the two largest liquid oxygen cryogenic tanker fleets globally — thousands of vacuum-insulated trailers delivering LOX to hospitals, steel mills, chemical plants, and semiconductor fabs in 80+ countries. Linde does not primarily manufacture its own tankers (purchases from Chart Industries and other OEMs) but specifies custom vacuum-insulated designs for its fleet. Linde's medical oxygen business (hospital LOX supply) is the dominant fleet use case. Linde also supplies liquid oxygen rocket propellant to aerospace customers including NASA and commercial launch operators.

Supplies these inputs

Neon Gas (Chip-Grade)

Replaceability

Substitutability 35% · 6 mo to replace

Business segments

  • Industrial & Atmospheric Gases60% rev
  • Specialty & Electronic Gases15% rev
  • Hydrogen Production & Infrastructure10% rev
  • Linde Engineering (Technology Licensing & Plant Construction)10% rev

Samsung Electronics Co., Ltd. (KRX: 005930; ~$200B revenue) is the world's largest NAND flash memory manufacturer with ~33% global market share. Samsung's NAND operations span the Pyeongtaek P3 complex (South Korea) and — critically — the Xi'an, Shaanxi, China facility, which is Samsung's largest single NAND fab by capacity. Samsung received a one-year BIS export control exemption (later extended) to continue upgrading Xi'an equipment under US restrictions. Samsung pioneered 3D NAND V-NAND technology in 2013 (first commercial 3D NAND) and now produces 200+ layer V-NAND. Also produces DRAM (world's largest) and logic chips (Exynos, foundry).

Supplies these inputs

Advanced Logic Wafer (TSMC N3/N4) · CoWoS Advanced Packaging (TSMC) · HBM (High Bandwidth Memory) Stack

Replaceability

Substitutability 20% · 24 mo to replace

Business segments

  • NAND Flash Memory (World #1)28% rev
  • DRAM Memory (World #1)25% rev
  • Samsung Foundry (Logic Chips) + Exynos20% rev
  • Consumer Electronics (Smartphones, TVs, HVAC)20% rev

Tokyo Ohka Kogyo Co., Ltd. (TOK; Kawasaki, Kanagawa; TSE: 4186; ~¥260B revenue) is Japan's third-largest EUV photoresist manufacturer, holding approximately 15-20% of the global EUV photoresist market. TOK's primary EUV resist production is at its Kanagawa (Kawasaki) plant. TOK operates the TAJRC (Tama Advanced Research Joint Center) in Tama, Tokyo — a next-generation resist development laboratory focused on High-NA EUV and metal-oxide resist chemistries. TOK's fluorinated polyimide was one of the three chemicals targeted in Japan's July 2019 export controls on South Korea. Also produces chemical mechanical planarization (CMP) slurries and developer chemicals for semiconductor fabs.

Supplies these inputs

Specialty Semiconductor Process Chemicals

Replaceability

Substitutability 10% · 24 mo to replace

Business segments

  • EUV & DUV Photoresists45% rev
  • Specialty Process Chemicals30% rev
  • Fluorinated Polyimide & Electronic Materials15% rev
  • High-NA EUV & Next-Gen Development10% rev

Micron Technology, Inc. (Nasdaq: MU; ~$25B revenue) is the world's #5 NAND flash manufacturer with ~11% global market share. Micron's NAND operations span Boise ID (R&D and manufacturing), Hiroshima Japan (inherited from Elpida Memory acquisition 2013, produces NAND and DRAM), and Singapore (300mm NAND wafers). Micron is the only US-headquartered company with significant NAND manufacturing scale. Micron has been aggressive on 3D NAND layer count — reaching 232-layer QLC in 2022 — and also leads in 3D NAND cost efficiency per bit through innovative array architecture.

Supplies these inputs

HBM (High Bandwidth Memory) Stack

Replaceability

Substitutability 20% · 24 mo to replace

Business segments

  • DRAM (Only US Manufacturer)50% rev
  • NAND Flash30% rev
  • Automotive + Embedded Memory12% rev
  • Storage Solutions8% rev
Air Liquide S.A.
HQ FR18% share

French industrial gas company (Euronext: AI); operates nearly 2,000 miles of industrial gas pipelines along the U.S. Gulf Coast supplying oxygen, nitrogen, and hydrogen. La Porte, Texas hydrogen facility serves Gulf Coast refiners. $50M investment announced October 2025 to expand Gulf Coast hydrogen distribution after new refinery supply deals. Also building new U.S. ultra-pure gas facility (including neon for semiconductors). Partner in HyVelocity Hub (DOE-funded $1.2B Gulf Coast hydrogen hub, launched November 2024).

Supplies these inputs

Neon Gas (Chip-Grade)

Replaceability

Substitutability 35% · 6 mo to replace

Business segments

  • Gas & Services (Industrial)40% rev
  • Gas & Services (Electronics)25% rev
  • Hydrogen Energy & Refining20% rev
  • Healthcare & Medical Gases15% rev

Shin-Etsu Chemical Co., Ltd. (Tokyo; TSE: 4063; ~¥2.3 trillion revenue) is Japan's second-largest EUV photoresist supplier, holding approximately 20-25% of the EUV photoresist market through its SEPR (Shin-Etsu Polymer Resist) product line. Primary EUV resist production at Niigata and Gunma facilities in Japan. The same parent company is the world's largest polyvinyl chloride (PVC) producer, the world's largest silicon wafer producer (through Shin-Etsu Silicones/SEH), and a major hydroxypropyl methylcellulose (HPMC) pharmaceutical excipient manufacturer. Shin-Etsu's photoresist was among the materials covered by Japan's July 2019 export controls targeting South Korea, as fluorinated polyimide — a resist ancillary material — was one of the three restricted chemicals.

Supplies these inputs

Specialty Semiconductor Process Chemicals

Replaceability

Substitutability 10% · 24 mo to replace

Business segments

  • Semiconductor Silicon Wafers (World #1)30% rev
  • Photoresists + Semiconductor Chemicals15% rev
  • Polyvinyl Chloride (PVC) — World #1 Producer25% rev
  • Silicones + Specialty Chemicals20% rev

Air Products and Chemicals (NYSE: APD; Allentown, PA; ~$12B revenue) licenses the APCI (Air Products and Chemicals, Inc.) natural gas liquefaction process technology used in many small- and mid-scale LNG liquefaction trains worldwide, including utility peak-shaving plants. The APCI propane pre-cooled mixed refrigerant (C3MR) process dominates large baseload LNG export trains globally (used in >90% of world's baseload LNG capacity), but Air Products also licenses adapted cycles for smaller peak-shaving applications. Air Products competes with Linde Engineering for small-scale liquefaction process technology licensing. Air Products is also the world's largest industrial gas producer, supplying nitrogen and other gases used in LNG facility construction and purging.

Supplies these inputs

Neon Gas (Chip-Grade)

Replaceability

Substitutability 35% · 6 mo to replace

Business segments

  • Industrial Gases (Core Business)55% rev
  • LNG Technology Licensing (APCI C3MR)5% rev
  • Semiconductor & Electronics Gases15% rev
  • Clean Hydrogen (Major Strategic Bet)15% rev
Fujifilm Holdings
HQ JP12% share

Fujifilm Holdings Corporation (Tokyo; TSE: 4901; ~¥3.6 trillion revenue) is an aggressively expanding EUV photoresist supplier, targeting approximately 10% of the global EUV resist market through its Electronic Materials division. Fujifilm's EUV resist production facility is at Yoshida-Minami, Shizuoka, Japan. Fujifilm's pivot from consumer photography (film and cameras) to semiconductor chemicals and medical imaging systems is one of the most dramatic industrial transformations in Japanese corporate history — the same company known for photographic film for 90 years is now developing photoresist for 13.5nm EUV lithography. Fujifilm's photochemistry expertise from film manufacturing transferred directly to photoresist development.

Supplies these inputs

Specialty Semiconductor Process Chemicals

Replaceability

Substitutability 15% · 18 mo to replace

Business segments

  • Electronic Materials (Photoresists)15% rev
  • Healthcare & Medical Imaging40% rev
  • Pharmaceuticals & Bio-CDMO15% rev
  • Document Solutions & Printing20% rev
Ingas (Ukraine)
HQ UA10% share

Ukrainian rare gas company (Mariupol, Donetsk Oblast); was the world's largest supplier of semiconductor-grade neon before the Russian invasion of Ukraine in February 2022. Ingas produced crude neon from the Mariupol Ilyich Iron & Steel Works (one of Ukraine's largest steel plants) — a massive ASU byproduct stream that was purified to semiconductor grade (5N+ purity) for sale to chip manufacturers globally. Ingas reportedly supplied approximately 25-30% of global semiconductor-grade neon. The company's facilities in Mariupol were effectively destroyed or seized during Russia's brutal siege of Mariupol in March-April 2022 — the same siege that made Mariupol's Azovstal Steel Plant famous for the Ukrainian military's last stand. When Ingas stopped operating, a significant fraction of global semiconductor neon supply disappeared overnight. TSMC, Samsung, Intel, and other major chip manufacturers scrambled to find alternative sources.

Supplies these inputs

Neon Gas (Chip-Grade)

Replaceability

Substitutability 15% · 36 mo to replace

Business segments

  • Semiconductor-Grade Neon (Pre-2022)80% rev
  • Industrial & Specialty Gases (Pre-2022)20% rev

Chinese specialty gas manufacturer in Guangdong; one of the leading Chinese producers of semiconductor-grade neon and other rare gases. Identified as a supplier to ASML for noble gases used in lithography equipment. China expanded national neon purification capacity by 85% in 2022-2023 via state-backed initiatives; Chinese producers collectively captured ~38% of global market by 2024. Huate Gas is among the largest named beneficiaries of this expansion.

Supplies these inputs

Neon Gas (Chip-Grade)

Replaceability

Substitutability 30% · 9 mo to replace

Business segments

  • Semiconductor-Grade Neon50% rev
  • Rare & Specialty Gases30% rev
  • Industrial Gases20% rev

Where it's made

Facilities

28 facilities producing inputs that feed gpus and ai accelerators.

AGC Electronics EUV Photomask Blank Plant (Koriyama)

JP

AGC Inc. · Fukushima Prefecture · manufacturing

AGC Electronics Co., Ltd. (100% AGC Inc. subsidiary) at Machiike-dai 1-8, Koriyama, Fukushima. Production started January 2022; capacity expansion January 2024 targeting ¥40B+ in EUV blank sales by 2025 (30% capacity increase). Sole AGC facility for EUV blanks — no secondary site. Located in Fukushima Prefecture, ~200 km from Tokyo. Source: https://www.agc.com/en/news/detail/1203819_2814.html

ASE Kaohsiung CoWoP Packaging Facility

TW

ASE Technology Holding · Kaohsiung · packaging

ASE Technology's primary CoWoP (Chip-on-Wafer-on-Panel) advanced packaging operation in Kaohsiung. Projected to reach 20,000-25,000 wspm by end 2025 (3x expansion). TSMC outsourcing 240K-270K wafers/year to ASE (and Amkor) starting 2026. Serves mid-tier AI ASIC packaging — not yet primary route for NVIDIA Blackwell-class. Source: https://www.trendforce.com/news/2025/12/08/news-tsmcs-cowos-l-s-reportedly-fully-booked-osat-partners-step-up-with-ases-cowop-in-focus

ASML Veldhoven HQ & Manufacturing

NL

ASML · Veldhoven, North Brabant, Netherlands · manufacturing

The sole facility where EUV and High-NA EUV lithography machines are assembled. Each machine ships in 40 freight containers and requires ~1 year to install and qualify at customer sites. No second-source exists.

Air Liquide China Neon Extraction Plant (2023)

CN

Air Liquide S.A. · China · processing

Air Liquide commissioned new neon extraction plant in China in 2023, adding +2 million m³/year of chip-grade neon capacity. Part of broader response to 2022 Ukraine supply disruption. Also investing >$250M in new U.S. ultra-pure gas production facility. Source: https://www.airliquide.com

Air Products Rare Gases Purification (Arizona)

US

Air Products and Chemicals, Inc. · Arizona · processing

Air Products expanded rare gases purification capacity in October 2024 — boosting chip-grade neon output for DUV lithography. U.S. production increase of 30% announced for semiconductor demand through 2032. Source: https://www.linde-engineering.com/products-and-services/success-stories/2024/invisible-but-indispensable-electronics-gases-keep-the-chips-flowing

Ajinomoto Fine-Techno Kawasaki Plant

JP

Ajinomoto Fine-Techno · Kawasaki, Kanagawa, Japan · materials-manufacturing

Primary ABF film production facility. ~90-95% of all advanced CPU/GPU substrate film produced here. Capacity expansions announced: JPY 25B investment by 2030 to meet AI chip demand.

Ajinomoto Fine-Techno Kawasaki Plant

JP

Ajinomoto Fine-Techno · Kanagawa · manufacturing

Primary ABF film production; Ajinomoto Fine-Techno supplies ~95% of global ABF raw film from this Kawasaki/Kanagawa facility. Annual capacity ~10M m². Multiple expansion rounds in 2021–2024 due to AI-driven shortage.

Amkor K5 Advanced Packaging (Songdo, South Korea)

KR

Amkor Technology · Incheon · packaging

Amkor's K5 facility in Songdo, Incheon; primary advanced 2.5D packaging site. Tripled capacity to ~7,000 wspm by late 2024. Intel manufacturing partner for EMIB high-volume production. Receives TSMC CoWoS overflow outsourcing starting 2026. Source: https://www.trendforce.com/news/2023/10/13/news-amkors-vietnam-plant-meets-high-end-semiconductor-demand-as-advanced-packaging-thrives

BASF Electronic Materials Guanyin Plant (Taiwan)

TW

BASF Electronic Materials · Taoyuan · manufacturing

BASF primary semiconductor materials facility in Guanyin, Taoyuan, Taiwan (acquired from Merck KGaA in 2014). Produces CMP slurries and cleaning agents for TSMC and other Taiwan fabs. Strategic location adjacent to major fab customers. Source: https://electronics-electric.basf.com/global/en/electronics/semiconductors_solutions

Corning Canton ULE Glass Substrate Plant (New York)

US

Corning · New York · manufacturing

Corning Canton, NY facility producing EXTREME ULE (Ultra-Low Expansion) glass for EUV photomask blank substrates. Received $32M CHIPS Act funding to expand capacity (2025-2026 timeline). Supplies raw substrates to Hoya and AGC — NOT finished blanks. Mo/Si multilayer coating performed exclusively in-house at Hoya Kumamoto and AGC Koriyama. Source: https://marklapedus.substack.com/p/corning-expands-glass-production

Cryoin Odessa Plant (Halted)

UA

Cryoin Engineering · Odessa Oblast · processing

Cryoin Engineering rare gas purification facility in Odessa, Ukraine. Halted all operations on February 24, 2022 (day of Russian invasion). Pre-war capacity ~10,000-15,000 m³/month chip-grade neon. Cryoin launched South Korea JV ('Cryoin Korea' with JI Tech) to relocate production capacity outside Ukraine; operational 2024-2026. Source: https://www.openpr.com/news/4399709/cryoin-korea-jv-scaling-global-rare-gas-production-beyond-ukraine

DuPont Electronics Sasakami Plant (Niigata, Japan)

JP

DuPont Electronics (DuPont de Nemours) · Niigata Prefecture · manufacturing

DuPont Electronics primary photoresist manufacturing facility in Agano-shi (Sasakami), Niigata, Japan. Major expansion completed October 2024 — nearly doubled capacity — with new East Star Building featuring ISO Class 10-1000 cleanrooms and advanced automation. Produces g-line through EUV photoresists. DuPont is a U.S. company, but its photoresist production is concentrated in Japan. Source: https://www.dupont.com/news/dupont-expands-photoresist-manufacturing-capacity-at-sasakami-site-in-japan.html

Fujifilm Shizuoka Photoresist Factory

JP

Fujifilm Holdings · Shizuoka Prefecture · manufacturing

Fujifilm primary photoresist manufacturing facility in Shizuoka. New ¥13B building completed November 2025 with AI-driven fine particle inspection system and advanced clean room for EUV photoresist development. Source: https://www.fujifilm.com/us/en/business/semiconductor-materials

Hoya EUV Photomask Blank Plant (Kumamoto)

JP

Hoya Corporation · Kumamoto Prefecture · manufacturing

Hoya's sole EUV photomask blank production facility in Kumamoto, Japan. Capacity: ~5.5 million units/year after two expansions (3M units/year added 2023; 2.5M units/year added February 2024). Only facility in the world producing High-NA EUV blanks validated for sub-2nm logic as of Q1 2025. A single contamination event or fire here would halt the High-NA EUV supply chain globally with no backup. Source: https://semiconductorinsight.com/blog/hoya-expands-euv-photomask-blank-capabilities-strengthening-global-semiconductor-supply-chain/

Huate Gas Plant (Guangdong)

CN

Huate Gas (Guangdong) · Guangdong · processing

Huate Gas primary rare gas production facility in Guangdong, China. One of the leading Chinese chip-grade neon producers; identified as ASML supplier for noble gases. China collectively expanded neon purification capacity 85% in 2022-2023 via state-backed initiatives, capturing ~38% of global market by 2024. Source: https://jh-gas.com/the-critical-role-of-noble-gases-helium-neon-krypton-xenon-in-semiconductor-manufacturing/

Ibiden Ogaki FC-BGA Substrate Plant

JP

Ibiden · Ogaki, Gifu Prefecture · substrate_manufacturing

Primary high-end ABF substrate fab for Intel, AMD, Nvidia CPUs. New capacity added 2023-2025 with METI subsidy support.

Ibiden Ogaki/Gifu Substrate Fabs

JP

Ibiden · Gifu · manufacturing

Ibiden's primary IC substrate manufacturing cluster in Ogaki and surrounding Gifu Prefecture; sole high-end ABF substrate supplier for NVIDIA AI GPU lineup.

Ingas Mariupol Plant (Captured — Not Operational)

UA

Ingas (Ukraine) · Donetsk Oblast · processing

Former primary production site for Ingas chip-grade neon in Mariupol, Ukraine. Captured by Russian forces March 2022 during the siege of Mariupol. NOT currently operational under original ownership. Was responsible for ~35-40% of global chip-grade neon supply pre-invasion. Crude neon feedstock came via rail from Russian steel mills; Ingas purified to 99.999%+ and exported to U.S. and European fabs. Management relocated to unoccupied Ukraine and has partially resumed production at undisclosed backup site. Source: https://era-ukraine.org.ua/en/mariupol-based-company-to-resume-supplying-inert-gases-to-foreign-markets/

Intel Oregon Fab (18A Node)

US

Intel Foundry (IFS) · Oregon · fab

Intel's Hillsboro, Oregon development and early-production fab for 18A process node. Risk production of Panther Lake CPUs ongoing (late 2025). Yields ~10% as of August 2025; improving at ~7%/month. High-volume production moving to Fab 32 (Chandler, Arizona) from late 2025. External customer viability expected 2027 at earliest when yields reach 50%+. Source: https://www.tomshardware.com/tech-industry/semiconductors/intel-ceo-recognizes-its-18a-node-for-external-customers-as-18a-p-gets-inbound-interest-company-cites-increasing-yields

Micron Boise Fab (ID1/10X)

US

Micron Technology · Idaho · semiconductor fab

Micron's primary US DRAM/HBM fab; receiving $6.1B CHIPS Act grant. HBM3e production began 2024; planned HBM4 from 2025.

SK Hynix Icheon M16 Fab — HBM and Advanced DRAM

KR

SK Hynix · Icheon, Gyeonggi-do · fab

SK Hynix's Icheon M16 fab — the world's primary HBM3e production facility and the most consequential DRAM fab for global AI infrastructure. M16 is SK Hynix's most advanced DRAM production line (1a/1b-nm class) and the site where HBM3e — the memory variant required by NVIDIA H100 and H200 AI accelerators — was first produced at volume. In 2023, all HBM3e chips in the world came from this facility; NVIDIA was on a multi-year waitlist. M16 also produces leading-edge DDR5 and LPDDR5X. Icheon campus capacity: M14 + M16 together represent approximately 280,000 wafer starts per month. SK Hynix is building M15X expansion and a new fab at Cheongju (NAND). Source: https://news.skhynix.com/sk-hynix-completes-the-construction-of-m16-fab-the-worlds-most-advanced-dram-production-facility/

Samsung Pyeongtaek P4 Fab

KR

Samsung Electronics · Gyeonggi-do · semiconductor fab

Samsung's fourth Pyeongtaek mega-fab; designated HBM4 mass-production site beginning 2026. Uses 1c (10nm-class) DRAM base die. P3 already producing HBM3e. ~100 km from North Korean border — within range of DPRK SRBMs/MRBMs. Rapid equipment procurement ongoing for 50% HBM capacity increase. Won OpenAI as anchor customer (March 2026) with 50%+ of capacity reportedly allocated. Source: https://www.datacenterdynamics.com/en/news/samsung-and-sk-hynix-to-scale-up-memory-production-capacity-in-2026-to-meet-ai-demand/

Shin-Etsu Naoetsu Photoresist Plant (Niigata)

JP

Shin-Etsu Chemical · Niigata Prefecture · manufacturing

Shin-Etsu Chemical primary photoresist facility in Naoetsu, Niigata; photoresist production launched 1997. One of the company's core semiconductor lithography material production sites. Source: https://www.shinetsu.co.jp/en/news/news-release/shin-etsu-chemical-to-build-a-new-production-base-in-japan-which-will-become-its-fourth-production-base-for-semiconductor-lithography-materials/

Shinko Nagano Substrate Plant

JP

Shinko Electric Industries · Nagano Prefecture · substrate_manufacturing

Primary manufacturing site for CPU/GPU flip-chip BGA substrates. Supplies Intel, AMD, and others. Key competitor to Ibiden in high-end substrate market.

TOK Koriyama Plant (Fukushima) — EUV/ArF

JP

Tokyo Ohka Kogyo (TOK) · Fukushima Prefecture · manufacturing

Tokyo Ohka Kogyo primary EUV and ArF photoresist manufacturing plant in Koriyama City, Fukushima Prefecture. Major ¥200B+ expansion underway; new building operational H2 2026 (will be TOK's largest plant). Suspended after April 20, 2026 magnitude 7.7 earthquake; 4-8 week resumption estimate. Combined with Shin-Etsu Shirakawa, Fukushima region disruptions represent ~25% of global advanced photoresist capacity at risk from a single seismic event. Source: https://www.trendforce.com/news/2026/04/21/news-kioxia-tel-and-photoresist-makers-in-focus-after-magnitude-7-7-japan-earthquake-supply-chain-impact-mixed/

TSMC AP6 CoWoS Packaging Fab (Chiayi)

TW

Taiwan Semiconductor Manufacturing Company (TSMC) · Chiayi · advanced packaging

New CoWoS fab opened 2024; part of TSMC's expansion of advanced packaging to 75K wafers/month by 2026 to meet NVIDIA Blackwell and future AI demand.

TSMC Fab 18 (Tainan) — N3/N4 Gigafab

TW

Taiwan Semiconductor Manufacturing Company (TSMC) · Tainan · fab

TSMC Fab 18, Southern Taiwan Science Park, Tainan — an 8-phase gigafab covering approximately 160,000 square meters (22 soccer fields). Primary production: N3 (3nm) and N4 (4nm EUV) nodes. Capacity: 150,000–160,000 wafer starts per month (wspm). This is the single most consequential industrial building on Earth for AI hardware — every NVIDIA H100, H200, and Blackwell GPU compute die was manufactured here. Fab 18 is located in an active seismic zone. April 3, 2024: M7.4 earthquake (Hualien) caused temporary disruptions to cleanroom operations; estimated 2–3 weeks partial recovery. December 2025: M7.0 earthquake — Taiwan's strongest in 27 years — Fab 18 escaped with minimal disruption due to extraordinary engineering safeguards. Source: https://www.usgs.gov/news/national-news-release/major-79-earthquake-strikes-taiwan

Taiyo Nippon Sanso Kimitsu Sanso Center

JP

Taiyo Nippon Sanso Holdings (Nippon Sanso Holdings) · Chiba Prefecture · processing

Taiyo Nippon Sanso neon purification facility at Kimitsu Sanso Center; new 27-million-liter/year purification system announced, operational start March 2026. Attached to steel mill infrastructure for crude neon sourcing. Supplies ~80% of Japan's domestic semiconductor-grade neon. Source: https://www.tn-sanso.co.jp/en/