Facility

YMTC Wuhan Fab (Phase 1 + Phase 2)

YMTC's Wuhan, Hubei fab complex (Phase 1 opened 2019; Phase 2 expansion 2022-2024) is China's only commercial-scale 3D NAND production facility. Total investment exceeding $24B, funded by the National Integrated Circuit Industry Investment Fund (the 'Big Fund'), Hubei provincial government, and Tsinghua Unigroup. Phase 1+2 capacity targeting ~200,000 NAND wspm at full ramp, though actual achieved capacity is unclear due to US Entity List restrictions (added October 2022) preventing YMTC from purchasing US equipment (Applied Materials, Lam Research, KLA). YMTC uses its proprietary Xtacking architecture — which bonds peripheral CMOS circuits to the memory array wafer-to-wafer — to achieve high layer counts (232L in 2022) without US equipment for critical steps. YMTC's rapid 64L→128L→232L progression (2019-2022, matching industry in 3 years) was described by US semiconductor analysts as 'the most alarming competitive advance' in NAND. Source: https://www.bis.doc.gov/index.php/documents/federal-register-notices/3207-october-7-2022-export-controls