Producer
Amkor Technology
Second-largest global OSAT; U.S.-headquartered with primary advanced packaging at K5 facility in Songdo, South Korea. Tripled advanced 2.5D packaging capacity at K5 to ~7,000 wspm by late 2024. Intel manufacturing partner for EMIB (Embedded Multi-Die Interconnect Bridge) high-volume production. TSMC outsourcing overflow CoWoS wafers to Amkor starting 2026. New Vietnam factory expanding into high-end packaging.
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Advanced Packaging (EMIB & 2.5D)
30%Fan-Out & High-Density Packaging
25%Standard Assembly & Test
30%Vietnam Advanced Packaging (Expansion)
15%
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Did you know2023
Amkor Technology's K5 Songdo facility simultaneously packages chips for Intel (EMIB technology for Intel's Ponte Vecchio and future products) and accepts TSMC CoWoS overflow wafers from 2026 onward -- meaning the world's two largest competing chip companies share the same South Korean packaging facility for their most advanced, strategically important products. Intel and TSMC compete across server, AI, and consumer chip markets, but their advanced packaging capacity constraints force both to rely on Amkor's K5 Songdo facility. A fire at K5, a South Korea labor dispute, or a North Korean escalation affecting Incheon logistics would simultaneously delay Intel's most advanced chip products and TSMC's AI chip overflow packaging -- degrading both US and Taiwan chip production from a single Korean facility that neither company publicly discloses as a shared resource.
Amkor Technology, Inc. ↗Origin2023
Amkor Technology was founded in 1968 by Kim Joo-Jin in Seoul, South Korea as Anam Industrial -- a company that began packaging US semiconductor chips in Korea using lower-cost Korean labor. In 1997, during the Asian financial crisis, the Kim family restructured the Korean operations and incorporated Amkor Technology Inc. in the United States (Delaware). The result was an OSAT with US corporate headquarters (Tempe, Arizona) and Korean manufacturing -- giving it US-headquartered status while maintaining Korean production expertise. The Kim family still controls significant Amkor ownership. The K5 facility in Songdo, South Korea (the master-planned city on reclaimed land near Incheon Airport) represents $2.4 billion in investment in advanced 2.5D and 3D packaging, positioned to serve Intel (EMIB production) and TSMC overflow demand simultaneously. A Korean-family-controlled, US-headquartered, Korea-based OSAT is the second-largest in the world and handles packaging for both major US chip companies (Intel) and Taiwan chip manufacturers (TSMC overflow).
Amkor Technology, Inc. ↗