Facility

Amkor K5 Advanced Packaging (Songdo, South Korea)

Operated by Amkor TechnologyKR · Incheonpackaging

Amkor's K5 facility in Songdo, Incheon; primary advanced 2.5D packaging site. Tripled capacity to ~7,000 wspm by late 2024. Intel manufacturing partner for EMIB high-volume production. Receives TSMC CoWoS overflow outsourcing starting 2026. Source: https://www.trendforce.com/news/2023/10/13/news-amkors-vietnam-plant-meets-high-end-semiconductor-demand-as-advanced-packaging-thrives

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