Facility
TSMC AP6 CoWoS Packaging Fab (Chiayi)
New CoWoS fab opened 2024; part of TSMC's expansion of advanced packaging to 75K wafers/month by 2026 to meet NVIDIA Blackwell and future AI demand.
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Inputs produced
1
Goods downstream
0
Incidents on record
0
Stories
What's produced here
1 input from this facility
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