Digital

Semiconductors and chips

Integrated circuits, microcontrollers, and chips embedded in vehicles, appliances, and electronics.

Why it matters · Chip shortages delay vehicle deliveries, raise appliance prices, and constrain electronics availability.

7

Inputs

22

Companies

7

Facilities

10

Source countries

How it's made

The process

  1. 01

    Wafer Preparation & Well Implantation

    300mm silicon wafers (Shin-Etsu, Sumco) cleaned and n/p-well regions formed by ion implantation to create the transistor substrate. For leading-edge nodes (3nm, 2nm), wafer surface preparation tolerances are sub-angstrom. TSMC and Samsung Foundry consume the majority of 300mm wafers.

  2. 02

    Front-End Lithography & Transistor Formation

    Multiple rounds of EUV/DUV lithography (ASML machines) pattern gate structures at 2–5nm dimensions. Advanced FinFET or Gate-All-Around (GAA, Samsung 3nm+, TSMC N2) transistors formed by precise etch, ALD, and thermal processes. Each leading-edge chip uses 100+ patterning steps; a single logic chip sees 2–3 EUV exposures per layer and 50+ DUV exposures total.

  3. 03

    Back-End-of-Line (BEOL) Metallization

    Up to 15 layers of copper interconnects deposited and patterned to wire transistors into circuits. Copper dual-damascene process with low-k dielectrics reduces signal delay. Cobalt and ruthenium liners used at advanced nodes to reduce resistance in narrow vias. Each additional metal layer requires another lithography + etch + CMP cycle.

  4. 04

    Wafer-Level Test & Probe

    Completed wafers electrically probed at each die location. Speed/power binning determines whether a die is high-end, mid-tier, or scrap. Yield — the percentage of functional dies per wafer — is the dominant cost driver at leading-edge nodes. TSMC N3 initial yields below 60% are common; mature N5 runs at 80%+.

  5. 05

    Advanced Packaging (Flip-Chip / Chiplet / CoWoS)

    Dies attached face-down to organic substrates using controlled-collapse chip connection (C4 bumps) or micro-bumps (for chiplets). High-end CPUs/GPUs/AI chips use TSMC's CoWoS (Chip-on-Wafer-on-Substrate) or Intel Foveros. The organic substrate — built on ABF (Ajinomoto Build-up Film) — is a near-monopoly supply item that became a critical shortage during the 2020–2021 chip crisis. Automotive MCUs use simpler wire-bond packaging.

  6. 06

    Final Package Assembly & Molding

    Packaged chips encapsulated in epoxy molding compound to protect against moisture, physical damage, and ESD. Solder balls or leads attached for PCB mounting. For automotive-grade chips, burn-in testing at elevated temperature/voltage screens infant-mortality failures per AEC-Q100 specification.

  7. 07

    Final Test & Qualification

    Each finished chip tested at speed/voltage corners. Automotive and industrial chips undergo extended qualification (AEC-Q100 Grade 0–3) adding 6–12 weeks vs. consumer chip timelines. This qualification requirement is why automotive chip shortages are acute — a new fab cannot quickly substitute for a qualified supplier even when wafer capacity exists elsewhere.

Where it comes from

Country dependencies

Weighted share of upstream inputs sourced from each country.

CountryWeighted shareInputs supplied to semiconductors and chips
NLNetherlands100%EUV Lithography Machines
JPJapan73%ABF Substrate (Ajinomoto Build-up Film) · EUV/ArF Semiconductor Photoresists · 300mm Silicon Wafers
UAUkraine30%Neon Gas (Semiconductor-Grade, for Excimer Lasers)
CNChina30%Neon Gas (Semiconductor-Grade, for Excimer Lasers)
RURussia15%Neon Gas (Semiconductor-Grade, for Excimer Lasers)
SGSingapore12%300mm Silicon Wafers
USUnited States11%EUV/ArF Semiconductor Photoresists · Neon Gas (Semiconductor-Grade, for Excimer Lasers)
KRSouth Korea11%ABF Substrate (Ajinomoto Build-up Film) · 300mm Silicon Wafers
TWTaiwan10%ABF Substrate (Ajinomoto Build-up Film) · 300mm Silicon Wafers
DEGermany7%EUV/ArF Semiconductor Photoresists · Neon Gas (Semiconductor-Grade, for Excimer Lasers) · 300mm Silicon Wafers

Who makes it

Supplier companies

22 companies in this supply chain, sorted by market share.

ASML Holding (ASML)
HQ NL100% shareSOLE SUPPLIER

ASML Holding N.V. (Nasdaq: ASML, Euronext: ASML); sole global manufacturer of EUV lithography scanners — 100% market share, no competitor within 10+ years. HQ and final assembly in Veldhoven, Netherlands. Manufactures only ~15% of scanner components internally; draws from 5,150+ global suppliers. TWINSCAN NXE series (low-NA, ~$183M): ~44-56 units/year. TWINSCAN EXE:5200 High-NA ($380M): 5-6 units/year currently, targeting 20/year by 2028. Record backlog €38.8B (Q4 2025); 18-24 month lead times. China dropped from 49% to ~20% of revenue after 2024 export controls. Owns 24.9% of Carl Zeiss SMT — its sole optics supplier.

Supplies these inputs

EUV Lithography Machines

Replaceability

Substitutability 0% · 120 mo to replace

Business segments

  • EUV Lithography Systems (Global Monopoly)55% rev
  • DUV Lithography Systems35% rev
  • Metrology, Inspection + Services10% rev

Subsidiary of Ajinomoto Group; sole commercial producer of ABF (Ajinomoto Build-up Film) used in ~95% of CPU and GPU substrates worldwide. ABF was invented from waste byproducts of MSG manufacturing.

Supplies these inputs

ABF Substrate (Ajinomoto Build-up Film)

Replaceability

Substitutability 20% · 18 mo to replace

Business segments

  • ABF (Ajinomoto Build-up Film) — Global Monopoly85% rev
  • Functional Materials (Electronic + Biomedical)15% rev
SK Inc. Materials
HQ KR42% share

South Korean specialty gas company, subsidiary of SK Group (better known for SK Hynix chips). World's largest NF3 producer with >40% global market share. First Korean company to domestically produce NF3 (2001). Supplies Samsung, SK Hynix, and global foundries.

Supplies these inputs

Semiconductor Etch Gases (NF₃, HF, WF₆)

Business segments

  • NF3 (Nitrogen Trifluoride) — World #160% rev
  • WF6 (Tungsten Hexafluoride) & Other Process Gases30% rev
  • New Materials (EV/Battery Connection)10% rev
JSR Corporation
HQ JP35% share

JSR Corporation (Tokyo; formerly JASDAQ/TSE: 4185; now private after delisting following Japan Investment Corporation nationalization in 2023) is Japan's leading life science materials company and manufacturer of Amsphere A3 Protein A affinity resin — one of the fastest-growing Protein A resin brands. JSR's Amsphere A3 uses a novel polymer bead architecture (highly cross-linked polymethacrylate) with proprietary recombinant Protein A ligand — designed for high dynamic binding capacity and long resin lifetime. In April 2023, the Japanese government's sovereign industrial fund INCJ (Innovation Network Corporation of Japan, now JIC) acquired a majority stake in JSR Corporation and took it private — an extraordinary step justified by JSR's dual strategic importance in semiconductor photoresists (JSR is the world's #2 photoresist producer, supplying TSMC and Samsung) and bioprocess materials (Amsphere A3). Japan explicitly nationalized JSR to prevent acquisition by non-Japanese parties and to secure domestic control of critical semiconductor and bioprocess supply chains — a template for strategic industry policy that no other major economy had applied to a life science materials company.

Supplies these inputs

EUV/ArF Semiconductor Photoresists

Replaceability

Substitutability 15% · 18 mo to replace

Business segments

  • Semiconductor Photoresists (World #2)45% rev
  • Bioprocess Materials (Protein A + Life Science)20% rev
  • Synthetic Rubber (Original Business)25% rev
  • Display + Other Materials10% rev

Resonac Holdings K.K. (Tokyo; TSE: 4004; formed 2023 by merger of Showa Denko K.K. and Hitachi Chemical Company Ltd.) is Japan's second-largest ABF substrate film producer after Ajinomoto Fine-Techno, and major semiconductor materials company. Resonac's semiconductor materials division produces ABF-equivalent build-up films under the brand name 'MCL' (Multilayer build-up resin for Core-Less substrates). The merger creating Resonac combined Showa Denko (industrial chemicals, graphite electrodes, specialty gases) with Hitachi Chemical (now Resonac Holdings; adhesives, printed circuit board materials, semiconductor packaging resins) — creating a $8B+ semiconductor materials company directly competing with Ajinomoto in FC-BGA substrates. Showa Denko had itself absorbed Hitachi Chemical in 2021 and rebranded to Resonac in 2023.

Supplies these inputs

ABF Substrate (Ajinomoto Build-up Film)

Replaceability

Substitutability 25% · 18 mo to replace

Business segments

  • Semiconductor & Electronics45% rev
  • Graphite & Carbon Products25% rev
  • Chemicals20% rev
  • Inorganic & Functional Materials10% rev

Shin-Etsu Chemical Co., Ltd. (Tokyo; TSE: 4063; ~¥2.3 trillion revenue) is Japan's second-largest EUV photoresist supplier, holding approximately 20-25% of the EUV photoresist market through its SEPR (Shin-Etsu Polymer Resist) product line. Primary EUV resist production at Niigata and Gunma facilities in Japan. The same parent company is the world's largest polyvinyl chloride (PVC) producer, the world's largest silicon wafer producer (through Shin-Etsu Silicones/SEH), and a major hydroxypropyl methylcellulose (HPMC) pharmaceutical excipient manufacturer. Shin-Etsu's photoresist was among the materials covered by Japan's July 2019 export controls targeting South Korea, as fluorinated polyimide — a resist ancillary material — was one of the three restricted chemicals.

Supplies these inputs

300mm Silicon Wafers

Replaceability

Substitutability 30% · 24 mo to replace

Business segments

  • Semiconductor Silicon Wafers (World #1)30% rev
  • Photoresists + Semiconductor Chemicals15% rev
  • Polyvinyl Chloride (PVC) — World #1 Producer25% rev
  • Silicones + Specialty Chemicals20% rev

World's second-largest silicon wafer manufacturer (~25–30% global share). Pure-play wafer company (unlike Shin-Etsu which is diversified). Sumco + Shin-Etsu together supply 60–70% of global 300mm semiconductor wafers. Samsung is a major investor (via SK Siltron subsidiary).

Supplies these inputs

300mm Silicon Wafers

Replaceability

Substitutability 30% · 24 mo to replace

Business segments

  • Silicon Wafers 300mm (Advanced Logic + Memory)65% rev
  • Silicon Wafers 200mm (Mature + Specialty)25% rev
  • Silicon Wafers 150mm and Smaller10% rev

Iceblick Ltd (Odessa, Ukraine) was the world's largest semiconductor-grade neon producer by volume before February 2022 — producing approximately 15-30% of global semiconductor-grade neon from crude neon sourced as a byproduct of Ukrainian steel production. Iceblick also produces krypton, xenon, and argon for industrial and specialty gas markets. The company's neon purification capacity is located in Odessa, which was not occupied during Russia's 2022 invasion but was subjected to missile attacks and port blockades affecting operations. Iceblick has resumed partial operations post-2022 but the Ukrainian steel industry (a primary crude neon source) has been severely reduced by the war, limiting crude neon feedstock availability.

Supplies these inputs

Neon Gas (Semiconductor-Grade, for Excimer Lasers)

Replaceability

Substitutability 35% · 18 mo to replace

Business segments

  • Semiconductor-Grade Neon55% rev
  • Krypton & Xenon30% rev
  • Argon & Industrial Gases15% rev

Japan's second-largest photoresist manufacturer (~25% global market share). Produces ArF immersion and EUV photoresists critical for advanced DRAM/NAND patterning. Investing in new photoresist production for 2nm chips alongside JSR. JSR government acquisition and TOK expansion represent Japan's strategic lockdown of this sector.

Supplies these inputs

EUV/ArF Semiconductor Photoresists

Replaceability

Substitutability 15% · 18 mo to replace

Business segments

  • EUV and ArF Photoresists55% rev
  • Developer and Process Chemicals25% rev
  • EUV Pellicles + Photomask Materials10% rev
  • Advanced Packaging + Display Materials10% rev
SUMCO (SUOPY)
HQ JP23% share

Second-largest silicon wafer manufacturer globally with ~23% share of 300mm market. Joint venture heritage from Mitsubishi Materials and Sumitomo Metal Industries. Critical supplier to TSMC and Samsung.

Supplies these inputs

300mm Silicon Wafers

Replaceability

Substitutability 25% · 36 mo to replace

Business segments

Shin-Etsu Chemical Co., Ltd. (Chiyoda-ku, Tokyo; TSE: 4063; ~¥2.1T revenue; ~$14B) is the world's largest PVC resin producer and one of its top two or three silicone producers globally, with approximately 15-20% global silicone market share. Shin-Etsu's silicones division produces KF-96 series dimethicone fluids (5 to 100,000 cSt viscosities) that are widely used in personal care formulations across Asia and globally — KF-96 is one of the most recognized cosmetic-grade dimethicone references in personal care ingredient databases. Primary silicone manufacturing is at Naoetsu, Niigata Prefecture (Japan Sea coast) and Gunma Prefecture plants. Shin-Etsu Chemical's enormous scale in both PVC and silicones makes it unique: the company produces chloromethane (methyl chloride) — the key Müller-Rochow process reagent — from its chlor-alkali operations, giving it vertical integration from chlorine production through dimethicone. Shin-Etsu also produces EUV photoresists, making it a supplier to both haircare formulators and TSMC's 3nm fab within the same corporate entity.

Supplies these inputs

EUV/ArF Semiconductor Photoresists

Replaceability

Substitutability 15% · 24 mo to replace

Business segments

  • PVC & Chlor-Alkali36% rev
  • Silicones27% rev
  • Semiconductor & Electronics Materials25% rev
  • Functional Materials12% rev

Ukrainian specialty gas company (Odesa/Odessa, Ukraine); one of the two major Ukrainian semiconductor-grade neon producers before and during the 2022 Russian invasion. Cryoin's Odesa facility processes crude neon from Ukrainian steel mill ASUs into semiconductor-grade product (5N purity — 99.999%) for export to Asian and European chip manufacturers. Unlike Ingas in Mariupol, Cryoin's Odesa facility was not directly destroyed in the early months of the war — Odesa, while subject to missile attacks, remained under Ukrainian control. Cryoin reportedly supplied approximately 20-30% of global semiconductor-grade neon pre-war. Cryoin's continued operations represent a tenuous supply lifeline for semiconductor manufacturers — operating in a country at war, subject to electricity shortages, and under constant threat from Russian missile strikes on Ukraine's energy infrastructure (which Russia systematically targeted starting in late 2022). Each Russian strike on Ukrainian power infrastructure disrupted Cryoin's neon purification operations.

Supplies these inputs

Neon Gas (Semiconductor-Grade, for Excimer Lasers)

Replaceability

Substitutability 35% · 12 mo to replace

Business segments

  • Semiconductor-Grade Neon (5N)55% rev
  • Xenon (Electronic & Space Grade)25% rev
  • Krypton (Satellite & Insulating Glass)15% rev
  • Crude Gas Processing & Other Rare Gases5% rev

Doosan Electro-Materials Co., Ltd. (Icheon, Gyeonggi-do South Korea; subsidiary of Doosan Group) is South Korea's primary ABF substrate film producer and the only significant non-Japanese competitor in the global ABF market. Doosan Electro-Materials produces CCL (Copper Clad Laminate), prepreg, and ABF-type build-up films for FC-BGA advanced package substrates. Doosan Group's electronics materials subsidiary benefits from Korean semiconductor supply chain proximity (Samsung, SK Hynix substrate assemblers). Doosan Electro-Materials was established in the 1980s as a PCB laminate producer and entered the FC-BGA substrate film market in the 2010s as demand from Korean chip packaging companies grew.

Supplies these inputs

ABF Substrate (Ajinomoto Build-up Film)

Replaceability

Substitutability 25% · 18 mo to replace

Business segments

  • ABF Build-up Films (FC-BGA)40% rev
  • Copper Clad Laminate (CCL)40% rev
  • Prepreg & Specialty Films20% rev

Taiwanese silicon wafer company (TWSE: 6488, HQ Hsinchu Science Park; ~NT$60B revenue; Sino-American Silicon Products parent); world's 3rd-largest 300mm silicon wafer producer after acquiring SunEdison Semiconductor (US, formerly Monsanto Electronic Materials Company) in 2016. GlobalWafers operates wafer manufacturing in Taiwan, Japan, South Korea (South Korea facility from Siltron purchase), Denmark, and Texas USA. The failed 2022 acquisition of Siltronic (blocked by Germany) would have made GlobalWafers the world's 2nd-largest silicon wafer company by capacity. GlobalWafers is controlled by the Hsu Hao (徐秀蘭) family — the same Taiwanese industrial family behind Sino-American Silicon Products, one of Taiwan's largest silicon-based materials companies.

Supplies these inputs

300mm Silicon Wafers

Replaceability

Substitutability 20% · 36 mo to replace

Business segments

  • 300mm Silicon Wafers65% rev
  • 200mm and Smaller Silicon Wafers30% rev
  • Specialty Wafers5% rev
Siltronic AG
HQ DE13% share

German silicon wafer company (Frankfurt Stock Exchange: WAF, HQ Munich; ~€1.9B revenue; Wacker Chemie spun off 2015); world's 3rd or 4th-largest 300mm silicon wafer producer with manufacturing in Germany (Burghausen, Freiberg), Singapore, and Portland Oregon USA. Siltronic supplies polished and epitaxial silicon wafers to TSMC, Samsung, Intel, and other major chipmakers. Siltronic's parent Wacker Chemie sold its majority stake in 2015 IPO; Wacker retains a minority. In January 2022, Germany's federal government blocked GlobalWafers' (Taiwan) €4.35B acquisition of Siltronic, citing strategic industry concerns — specifically that allowing a Taiwanese company to control the only significant German silicon wafer manufacturer would create national security and supply chain risks for European semiconductor manufacturing. The blocking of the GlobalWafers/Siltronic deal was one of the first major examples of EU/German semiconductor supply chain protectionism, preceding the European Chips Act.

Supplies these inputs

300mm Silicon Wafers

Replaceability

Substitutability 20% · 36 mo to replace

Business segments

  • 300mm Polished & Epitaxial Silicon Wafers70% rev
  • 200mm and Smaller Silicon Wafers25% rev
  • Specialty Silicon Products5% rev
Ingas (Ukraine)
HQ UA12% share

Ukrainian rare gas company (Mariupol, Donetsk Oblast); was the world's largest supplier of semiconductor-grade neon before the Russian invasion of Ukraine in February 2022. Ingas produced crude neon from the Mariupol Ilyich Iron & Steel Works (one of Ukraine's largest steel plants) — a massive ASU byproduct stream that was purified to semiconductor grade (5N+ purity) for sale to chip manufacturers globally. Ingas reportedly supplied approximately 25-30% of global semiconductor-grade neon. The company's facilities in Mariupol were effectively destroyed or seized during Russia's brutal siege of Mariupol in March-April 2022 — the same siege that made Mariupol's Azovstal Steel Plant famous for the Ukrainian military's last stand. When Ingas stopped operating, a significant fraction of global semiconductor neon supply disappeared overnight. TSMC, Samsung, Intel, and other major chip manufacturers scrambled to find alternative sources.

Supplies these inputs

Neon Gas (Semiconductor-Grade, for Excimer Lasers)

Replaceability

Substitutability 40% · 36 mo to replace

Business segments

  • Semiconductor-Grade Neon (Pre-2022)80% rev
  • Industrial & Specialty Gases (Pre-2022)20% rev

Japan's largest and world's fifth-largest industrial gas company. MATHESON rebranded to Nippon Sanso MATHESON in April 2026. Particularly strong in electronics-grade specialty gases: NF3, WF6, SiH4, GeH4 for semiconductor fabs.

Supplies these inputs

Semiconductor Etch Gases (NF₃, HF, WF₆)

Business segments

  • Electronics Specialty Gases (MATHESON brand)35% rev
  • Industrial & Medical Gases (Japan/Asia)40% rev
  • MATHESON Americas (US Industrial)25% rev

Where it's made

Facilities

7 facilities producing inputs that feed semiconductors and chips.

ASML Veldhoven Headquarters & Manufacturing

NL

ASML Holding · Veldhoven, North Brabant · equipment_manufacturing

Only site in the world where EUV machines are assembled. Each EUV machine contains 100,000+ parts from 5,000+ suppliers and takes ~18 months to build. Ships ~50 units/year.

Ajinomoto Fine-Techno Kawasaki Production Facility

JP

Ajinomoto Fine-Techno · Kawasaki, Kanagawa · specialty_materials

Primary manufacturing site for ABF (Ajinomoto Build-up Film). Produces the insulating film shipped as panels to substrate manufacturers (Ibiden, Shinko Electric, AT&S) who build the organic substrates for Intel, AMD, Nvidia chip packages. Ajinomoto expanded capacity after 2021 shortage.

Cryoin Odessa Neon Facility

UA

Cryoin Engineering · Odessa, Ukraine · neon extraction and purification

Legacy Soviet-era air separation byproduct extraction. Halted February 24, 2022 upon Russia invasion. Represented part of the 45-54% Ukraine share of global semiconductor-grade neon.

JSR Yokkaichi Photoresist Plant

JP

JSR Corporation · Yokkaichi, Mie Prefecture · photoresist_manufacturing

Primary JSR photoresist manufacturing facility. Produces ArF, KrF, and EUV photoresists shipped globally to Samsung, SK Hynix, TSMC, Intel, and Micron. Post-nationalization (2023), now strategically managed under Japan's INCJ.

Shin-Etsu Shirakawa Silicon Wafer Plant

JP

Shin-Etsu Chemical · Shirakawa, Fukushima Prefecture · wafer_manufacturing

One of Shin-Etsu's primary 300mm wafer facilities; produces polished and epitaxial wafers for advanced logic and memory. Critical node in global wafer supply chain.

Sumco Saga Manufacturing Complex

JP

Sumco Corporation · Saga, Saga Prefecture · silicon_wafer_manufacturing

Sumco's largest 300mm wafer manufacturing complex. Together with Shin-Etsu's Japan facilities, dominates global semiconductor-grade wafer supply.

TSMC Hsinchu Science Park (Fab 12, 18)

TW

Taiwan Semiconductor Manufacturing Company (TSMC) · Hsinchu, Taiwan · logic_fab_advanced

TSMC's most advanced logic fabs. Fab 18 (N3/N2 production) in Hsinchu. Fab 12 handles N5/N4. Together, TSMC's Taiwan fabs produce ~92% of the world's sub-5nm logic chips. A Taiwan Strait conflict or blockade that shut TSMC Taiwan would remove the ability to manufacture leading-edge chips for Apple, Nvidia, AMD, and Qualcomm within weeks.