China Advanced Technology Monitoring Act
Sponsored By: Representative Vindman, Eugene Simon [D-VA-7]
Introduced
Summary
An annual federal report on China's semiconductor manufacturing capabilities. This bill would require the Secretary of Defense, working with other agencies, to deliver an unclassified report and a classified annex each year for five years beginning May 1, 2026. The report would provide year-by-year assessments of China’s advances across chip design, IP, R&D, silicon and critical minerals, equipment, materials, and advanced packaging, and would include policy recommendations to Congress.
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Bill Overview
Analyzed Economic Effects
1 provisions identified: 1 benefits, 0 costs, 0 mixed.
Annual public report on China chips
If enacted, DoD would send an annual report on China’s semiconductor manufacturing to the House and Senate Armed Services Committees. The first report would be due by May 1, 2026, then yearly for five years. It would cover China’s chip factories, AI chipmaking, policies, and ties with other countries, and include policy recommendations. It would review how U.S. and allied export controls are working and suggest fixes. An unclassified version or summary would be posted on a federal website with a Federal Register notice, and a classified annex would go to Congress.
Sponsors & CoSponsors
Sponsor
Vindman, Eugene Simon [D-VA-7]
VA • D
Cosponsors
Del. Moylan, James C. [R-GU-At Large]
GU • R
Sponsored 9/10/2025
Rep. Fitzpatrick, Brian K. [R-PA-1]
PA • R
Sponsored 10/6/2025
Roll Call Votes
No roll call votes available for this bill.
View on Congress.gov